B32B2311/00

METAL PLATE DESIGN FOR ELECTRONIC DISPLAY PANELS
20230047276 · 2023-02-16 ·

A method of assembling a display panel includes laminating a back plate to a display layer to form an untrimmed display panel, the back plate including a metal layer that includes a trimming path defined by one or more line segments having reduced metal content compared to other portions of the metal layer. The method further includes trimming the untrimmed display panel along the one or more line segments to define one or more edges of the display panel. For one or more locations along each of the one or more edges defined by the line segments, the metal layer is flush with the corresponding edge of the display panel.

JOINING STRUCTURE

A joining structure includes a first member, a second member of a material different from that of the first member, and a separation mechanism provided between the first member and the second member and that separates the first member and the second member from each other, wherein a resin is filled into the space between the edge of at least one member among the first member and the second member, and the other member.

DEPOSITION MASK AND MANUFACTURING METHOD

It comprises: a film made of a resin in which an aperture pattern is formed, the aperture pattern passing through the film, the aperture being with a shape and dimension corresponding to the thin-film pattern in a pre-established region for formation of the thin-film pattern on the substrate; and a metal member that has an aperture part opposite the aperture pattern with a shape and dimension larger than the aperture pattern, the metal member being provided as a thin sheet in intimate contact with one surface of the film on an outside part of the aperture pattern of the film. The film is mutually distanced and distributed, at a position where the film does not overlap the aperture pattern, into a plurality of divided parts on one surface of the metal member.

Conformal fluoropolymer coatings

Methods for forming a fluoropolymer coated component, such as a metal component, comprise applying an adhesion promoter onto a surface of the component; applying an organic material onto the adhesion promoter; and applying a mixture comprising a fluoropolymer and a solvent selected from a furan or a fluorinated solvent onto the organic material. Fluoropolymer coatings have a thickness of from about 5 mil to about 80 mil on a component, an average porosity of from about 20% to about 70% based on the total volume of the layer, and a void density of from about 10.sup.11 to about 10.sup.13 voids per cm.sup.3.

Support structure and manufacturing method thereof, and foldable display screen

The present disclosure provides a support structure and a manufacturing method thereof, and a foldable display screen. The support structure includes: a first support plate made of flexible conductive material; at least two second support plates arranged on the first support plate with interval, the second support plates being made of rigid conductive material, at least a part of surface of each of the second support plates being in contact with the first support plate.

Method of manufacturing metal-clad laminate and uses of the same

A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.

Water barrier exterior sheathing panel

An exterior sheathing cementitious panel which prevents water penetration and air leakage is provided. Methods for manufacturing exterior sheathing cementitious panels with a highly efficient integrated air/water barrier sheet are also provided. An exterior sheathing system employing the exterior sheathing cementitious panel is provided.

Vapor deposition mask with metal plate

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

CURABLE COMPOSITIONS

The present invention is directed to a curable composition including: an isocyanate-functional prepolymer; an epoxy-containing component present in an amount of at least 10 percent by weight of the composition; and a latent curing agent having an ability to react with at least one of the isocyanate-functional prepolymer and the epoxy-containing component upon exposure to an external energy source. The present invention is also directed to methods of making the compositions, methods of coating a substrate, methods of adhering substrates and coated substrates.

COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER-CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
20230034784 · 2023-02-02 · ·

A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a Mg—N compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the Mg—N compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces/μm.