Patent classifications
B32B2361/00
Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.
METHOD AND INSTALLATION FOR PRODUCING A MULTI-LAYERED WET FRICTION MATERIAL
A method for producing a multi-layered wet friction material includes providing a bottom layer, providing a top layer produced independently of the bottom layer from different materials, and bonding the bottom layer to the top layer. The bottom layer and the top layer may be produced from different formulations and supplied as raw papers. A formulation of the top layer may include twenty to sixty percent (20%-60%) filler, ten to forty percent (10%-40%) wood pulp, five to ten percent (5%-10%) aramid, and twenty-five to thirty-five percent (25%-35%) phenolic resin. A formulation of the bottom layer may include ten to fifty percent (10%-50%) filler, ten to forty percent (10%-40%) wood pulp, five to ten percent (5%-10%) aramid, five to fifteen percent (5%-15%) carbon, and twenty-five to thirty-five percent (25%-35%) phenolic resin.
METHOD AND SYSTEM FOR PRODUCING AN ENGINEERED WOOD
The present invention relates to a method for producing an engineered wood, comprising the steps of: (a) breaking down a veneer to increase its porosity; (b) impregnating the veneer from step (a) with an adhesive material; (c) drying the veneer from step (b) to a predetermined moisture content level; (d) arranging a plurality of the veneers from step (c) in a mould; and (e) pressing the plurality of the veneers in the mould. The engineered wood has an appearance of natural timber, and is able to withstand extreme weather conditions and have minimum warping, rotting and termite infestation.
Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board
A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.
Method and installation for producing a multi-layered wet friction material
A method for producing a multi-layered wet friction material includes providing a bottom layer, providing a top layer produced independently of the bottom layer from different materials, and bonding the bottom layer to the top layer. The bottom layer and the top layer may be produced from different formulations and supplied as raw papers. A formulation of the top layer may include twenty to sixty percent (20%-60%) filler, ten to forty percent (10%-40%) wood pulp, five to ten percent (5%-10%) aramid, and twenty-five to thirty-five percent (25%-35%) phenolic resin. A formulation of the bottom layer may include ten to fifty percent (10%-50%) filler, ten to forty percent (10%-40%) wood pulp, five to ten percent (5%-10%) aramid, five to fifteen percent (5%-15%) carbon, and twenty-five to thirty-five percent (25%-35%) phenolic resin.
METHOD OF MAKING WET FRICTION MATERIAL WITH WATER BASED PHENOLIC RESIN
A method of making a wet friction material layer includes joining filler particles and fibers together to form a material base; adding water based phenolic resin to the material base; and curing the water based phenolic resin.
UNCURED INSULATION ARTICLES COMPRISING CORROSION INHIBITORS AND METHODS OF PRODUCING THE SAME
The present disclosure generally relates to insulation articles including corrosion inhibitors and methods of producing the same are disclosed. In some embodiments, an article of manufacture comprising an insulation mat comprising an uncured combination of a plurality of randomly oriented fibers and a binder is provided. In further embodiments, the insulation mat extends between a first surface and a second surface, and a veil attached to the first surface and structured to inhibit physical movement of the cured combination through the veil is provided, as well as a metal sheet attached to the second surface by a water-containing adhesive contacting the metal sheet and the second surface, and a corrosion inhibitor composition deposited on the cured combination of the insulation mat, wherein the corrosion inhibitor composition is capable of modifying toward neutral a pH of the cured combination in contact with water from the water-containing adhesive.
Support carrier material with a modified resin layer, and the production thereof
A carrier material has a resin layer arranged on a side of the carrier material. The resin layer includes a formaldehyde resin, a polymer selected from a group containing polyacrylates, polyepoxides, polyesters, polyurethanes, and long-chain silanols, and at least one silane-containing compound of general formula (I), R.sub.a SiX.sub.(4-a), and/or the hydrolysis product thereof, where X is H, OH, or a hydrolyzable residue selected from the group comprising halogen, alkoxy, carboxy, amino, monoalkylamino or dialkylamino, aryloxy, acyloxy, alkylcarbonyl; R is a non-hydrolyzable organic residue R selected from the group comprising alkyl, aryl, alkenyl, substituted and unsubstituted alkynyl, cycloalkyl, which can be interrupted by O or NH; and where R can have a functional group Q selected from a group containing a hydroxy, ether, amino, monoalkylamino, dialkylamino, anilino, amide, carboxy, mercapto, alkoxy, aldehyde, alkylcarbonyl, epoxide, alkenyl, alkynyl, acryl, acryloxy, methacryl, methacryloxy, cyano, and isocyano group, and a is 0-3.
RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I):
##STR00001##
wherein m, n, 1, R.sub.1, and R.sub.2 are as defined in the specification.
RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED CIRCUIT BOARD
A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.