An ink composition for high-speed screen printing, includes a solvent with a boiling point of not less than 170° C. at not less than 70 wt % of the total solvent, and a prepolymer or polymer with a weight-average molecular weight of not less than 2000 at not less than 7 wt % with respect to the total ink composition, and having a viscosity of not less than 6 Pa.Math.s and less than 30 Pa.Math.s as measured with a BH-type rotating viscosimeter at 25° C., and a thixotropic index (TI value) of 2.0 to 8.0, the measured flow radius value of 14.0 to 24.0 mm after 1 minute from the start of measurement by a flow property measuring method using a spread meter at 25° C. according to JIS K5701-1:2000.

A system for printing documents and anti-forgery security papers especially banknotes is provided. The system includes a mechanical feeding mechanism, a hologram pattern print section, an invisible, fluorescence color and main colors pattern printing section using at least three units of ink jet, a varnish coating section, a rotating cylindrical silkscreen printing section for optical variable ink (OVI), a raised printing section, a delivery section, a paper and handle receiving section and a central computer control section. The system has been introduced to create various security features in securities wherein all of the processes including the raised printing are introduced in an all-in-on device.

Provided are a conductive composition for thin film printing and a method for forming a thin film conductive pattern, which can easily performing thin film printing, and can capable of improve conductivity by thermal sintering at a comparatively low temperature of 300° C. or less or by photo irradiation. A conductive composition comprises metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 5 to 98% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25° C. being 1.0×10.sup.3 to 2×10.sup.5 mPa.Math.s. The composition is printed in a pattern having any selected shape on a substrate, by screen printing, and the pattern is subjected to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

The present disclosure provides a solar cell production apparatus for processing a substrate. The solar cell production apparatus includes at least one substrate support configured to support the substrate; one or more printing stations configured for forming a printing structure on the substrate positioned on the substrate support; and an inspection system including at least one first camera, wherein the at least one first camera is configured for detecting a position of the printing structure on the substrate positioned on the substrate support while the substrate is passing through a field of view of the at least one first camera.

An ink composition for screen printing for a glass substrate includes a solvent with a boiling point at least 170° C. at least 70 mass % of the total solvent and a prepolymer or polymer with a weight-average molecular weight of at least 2000 at least at 2 mass % with respect to total ink composition, and with a viscosity of 5 to 180 Pa.Math.s measured with a BH-type rotating viscosimeter at 25° C. and thixotropic index (TI value) of 2.0 to 8.0, the measured flow radius value being 13.0 to 24.0 mm after 1 minute from start of measurement by a flow property measuring method using a spread meter at 25° C. according to JIS K5701-1:2000, satisfying “F60”−“F45”≦1.0 mm, where “F60” and “F45” are measured flow radius values after 1 minute and 45 seconds, respectively, from start of measurement, and containing a coupling agent compound.

An ink composition for screen printing for a glass substrate includes a solvent with a boiling point at least 170° C. at least 70 mass % of the total solvent and a prepolymer or polymer with a weight-average molecular weight of at least 2000 at least at 2 mass % with respect to total ink composition, and with a viscosity of 5 to 180 Pa.Math.s measured with a BH-type rotating viscosimeter at 25° C. and thixotropic index (TI value) of 2.0 to 8.0, the measured flow radius value being 13.0 to 24.0 mm after 1 minute from start of measurement by a flow property measuring method using a spread meter at 25° C. according to JIS K5701-1:2000, satisfying “F60”−“F45”≦1.0 mm, where “F60” and “F45” are measured flow radius values after 1 minute and 45 seconds, respectively, from start of measurement, and containing a coupling agent compound.

A method is disclosed for electroforming metal screen. The method deposits photoresist over a mandrel, and then exposes the photoresist with light through a plurality of openings in a photo tool to form hardened resist pillars. Unexposed photoresist is removed without affecting the resist pillars. The method then electroforms the metal screen in areas free of the hardened resist pillars such that the metal screen forms apertures defined by each of the resist pillars, a space between at least two of the resist pillars defining a support bar that forms at a reduced thickness as compared to portions of the metal screen that are not between the resist pillars. Finally, the method detaches the metal screen from the mandrel.

A method is disclosed for electroforming metal screen. The method deposits photoresist over a mandrel, and then exposes the photoresist with light through a plurality of openings in a photo tool to form hardened resist pillars. Unexposed photoresist is removed without affecting the resist pillars. The method then electroforms the metal screen in areas free of the hardened resist pillars such that the metal screen forms apertures defined by each of the resist pillars, a space between at least two of the resist pillars defining a support bar that forms at a reduced thickness as compared to portions of the metal screen that are not between the resist pillars. Finally, the method detaches the metal screen from the mandrel.

Provided is a method of manufacturing an electrostrictive element by which an electrostrictive element including an expandable and contradictable film electrode having a thin and uniform thickness can be easily formed. In a method of manufacturing an electrostrictive element 1, screen printing is performed while a first jig 12 contacts with a face of a dielectric film 2 opposite to a face where screen printing is performed such that the first jig 12 surrounds an area where the screen printing is performed. Thus, a film electrode 3 is formed.

Provided is a method of manufacturing an electrostrictive element by which an electrostrictive element including an expandable and contradictable film electrode having a thin and uniform thickness can be easily formed. In a method of manufacturing an electrostrictive element 1, screen printing is performed while a first jig 12 contacts with a face of a dielectric film 2 opposite to a face where screen printing is performed such that the first jig 12 surrounds an area where the screen printing is performed. Thus, a film electrode 3 is formed.