A measuring device, includes a physical property value detector and a push contact member that pushes to bring a sheet material in contact with the physical property value detector; and further includes a first processor that stops conveyance of the sheet material, pushes to bring the sheet material in contact with the physical property value detector, and detects a physical property value of the sheet material; a second processor that, after having detected the physical property value, cancels the pushing by the push contact member, separates the sheet material from the physical property value detector, and starts conveyance of the sheet material; and a physical property value specifier that specifies the physical property value on a basis of physical property values of a plurality of positions within a surface of the sheet material detected by executing the first processing and the second processing repeatedly.

A measuring device, includes a physical property value detector and a push contact member that pushes to bring a sheet material in contact with the physical property value detector; and further includes a first processor that stops conveyance of the sheet material, pushes to bring the sheet material in contact with the physical property value detector, and detects a physical property value of the sheet material; a second processor that, after having detected the physical property value, cancels the pushing by the push contact member, separates the sheet material from the physical property value detector, and starts conveyance of the sheet material; and a physical property value specifier that specifies the physical property value on a basis of physical property values of a plurality of positions within a surface of the sheet material detected by executing the first processing and the second processing repeatedly.

There is provided a method for cutting an adhesive film and an adhesive film that are novel and improved and capable of fabricating an adhesive film with a low glass transition point, high quality, and a width of less than 1 mm. According to an aspect of the present invention in order to achieve the above object, there is provided a method for cutting an adhesive film, the method including cutting, under a temperature environment of 40 to 10 C., an adhesive film that satisfies a condition of the following formula (1) and whose tack value per unit length under room temperature is 3N/cm or more.

y0.27x+11.4(1)

In the formula (1), x is a glass transition point ( C.) of the adhesive film, and y is a tack value per unit length (N/cm) under room temperature of the adhesive film.