A MEMS device includes: a first beam and a second beam that are symmetrically disposed with respect to a first rotation axis of a mirror portion, in which a third beam is disposed on a side opposite to the first beam and the second beam with reference to a line that is orthogonal to the first rotation axis and passes through a center of gravity of the mirror portion.

A MEMS device includes: a first beam and a second beam that are symmetrically disposed with respect to a first rotation axis of a mirror portion, in which a third beam is disposed on a side opposite to the first beam and the second beam with reference to a line that is orthogonal to the first rotation axis and passes through a center of gravity of the mirror portion.

This optical scanning device includes: a shaft part to which a mirror part is connected; a movable magnet; a base part; a ball bearing; a core unit that has a core body and a coil body and rotationally drives the movable magnet; and a magnet position holding member that is a magnetic body provided facing the movable magnet and magnetically attracts the movable magnet to a reference position. The core unit is disposed on the outer surface side of one wall section of a pair of wall sections of the base part. An angle sensor unit for detecting the rotation angle position of the shaft part is disposed between the core unit and the one wall section.

A microelectromechanical system MEMS structure is described. A first actuator is attached to a substrate and configured to rotate the substrate along a first axis of rotation. An array of rotatable MEMS mirrors is mounted on the substrate, aligned parallel to the first axis of rotation. Each rotatable MEMS mirror is rotatable about a second axis of rotation with each second axis of rotation being perpendicular to the first axis of rotation and parallel to every other axis of rotation. An array of second actuators is configured to rotate each of the rotatable MEMS mirrors about its corresponding second axis of rotation. A controller is configured to control the first actuator to rotate the substrate about the first axis of rotation. The controller further controls the array of second actuators to rotate each rotatable MEMS mirror of the array of rotatable MEMS mirrors about its corresponding second axis of rotation.

A microelectromechanical system MEMS structure is described. A first actuator is attached to a substrate and configured to rotate the substrate along a first axis of rotation. An array of rotatable MEMS mirrors is mounted on the substrate, aligned parallel to the first axis of rotation. Each rotatable MEMS mirror is rotatable about a second axis of rotation with each second axis of rotation being perpendicular to the first axis of rotation and parallel to every other axis of rotation. An array of second actuators is configured to rotate each of the rotatable MEMS mirrors about its corresponding second axis of rotation. A controller is configured to control the first actuator to rotate the substrate about the first axis of rotation. The controller further controls the array of second actuators to rotate each rotatable MEMS mirror of the array of rotatable MEMS mirrors about its corresponding second axis of rotation.

The invention relates to a microelectromechanical drive for moving an object, having electrostatic bending actuators, wherein each electrostatic bending actuator has a cantilever having at least one active element which has a layer stack forming at least one capacitor positioned offset to a center-of-gravity-plane of the cantilever which leads alongside a longitudinal axis of the cantilever from a supported end of the cantilever to a loose end, which is averted from the supported end of the cantilever and which has a contact area for engaging with the object.

The microelectromechanical drive can be used to displace any target objects from nanoscopic to macroscopic sizes that are within the force-displacement configurations of the electrostatic bending actuators. The microelectromechanical drive is suited to act as an inchworm drive.

This disclosure describes a comprising a handle wafer and a device wafer which is bonded to the handle wafer. The handle wafer comprises a cavity and the device wafer comprises a mobile rotor part above the cavity. A bottom coating layer covers at least a part of the bottom surface of the rotor.

This disclosure describes a comprising a handle wafer and a device wafer which is bonded to the handle wafer. The handle wafer comprises a cavity and the device wafer comprises a mobile rotor part above the cavity. A bottom coating layer covers at least a part of the bottom surface of the rotor.

In an example, a switchable display may include a movable pixel unit having a rotatable motive element. The movable pixel unit may further include a first display unit having a first display characteristic and disposed on a first side of the rotatable motive element. The movable pixel unit may further include a second display unit having a second display characteristic and disposed on a second side of the rotatable motive unit, different from the first side.

In an example, a switchable display may include a movable pixel unit having a rotatable motive element. The movable pixel unit may further include a first display unit having a first display characteristic and disposed on a first side of the rotatable motive element. The movable pixel unit may further include a second display unit having a second display characteristic and disposed on a second side of the rotatable motive unit, different from the first side.