Systems, apparatuses, and methods are provided for manufacturing an electrostatic clamp. An example method can include forming, during a first duration of time comprising a first time, a top clamp comprising a first set of electrodes and a plurality of burls. The method can further include forming, during a second duration of time comprising a second time that overlaps the first time, a core comprising a plurality of fluid channels configured to carry a thermally conditioned fluid. The method can further include forming, during a third duration of time comprising a third time that overlaps the first time and the second time, a bottom clamp comprising a second set of electrodes. In some aspects, the example method can include manufacturing the electrostatic clamp without an anodic bond.

Systems, apparatuses, and methods are provided for manufacturing an electrostatic clamp. An example method can include forming, during a first duration of time comprising a first time, a top clamp comprising a first set of electrodes and a plurality of burls. The method can further include forming, during a second duration of time comprising a second time that overlaps the first time, a core comprising a plurality of fluid channels configured to carry a thermally conditioned fluid. The method can further include forming, during a third duration of time comprising a third time that overlaps the first time and the second time, a bottom clamp comprising a second set of electrodes. In some aspects, the example method can include manufacturing the electrostatic clamp without an anodic bond.

There is provided a three-dimensional structure in which a multilayer film is three-dimensionally curved to form an interior space. The multilayer film includes a layer containing a carbon monoatomic layer substance, a support layer, and a curve induction layer that induces a curved structure, where the layer containing the carbon monoatomic layer substance is in contact with the interior space, and the support layer is positioned between the layer containing the carbon monoatomic layer substance and the curve induction layer.

Embodiments of a vehicle interior system and methods for forming the same are disclosed. A glass substrate is bent to a curved shape within a mold cavity, and a liquid polymer material is delivered to the mold and is in contact with the curved glass substrate. The liquid polymer is solidified to form a polymer frame that engages the bent glass substrate, and the engagement between the frame and the glass substrate holds the glass substrate in the bent shape. The temperature of the glass substrate during the bending process and formation of the frame are maintained below the glass transition temperature of the glass substrate.

This invention generally relates to a method of manufacturing hybrid parts comprising metallic and non-metallic materials at high temperature. During the method, a hollow metallic feedstock heated to a temperature in the austenite region may be placed in a die and filled with a non-metallic material in a viscous condition, after which the feedstock in the die is formed and then controlled-cooled to cause hardening of the non-metallic material in the region of contact between the metallic and non-metallic material. Afterwards, the semi-finished product is removed from the die and cooled to room temperature. The rate of cooling may be adjusted to generate compressive stress in the surface layer of the non-metallic material, which reduces the risk of cracking.

This invention generally relates to a method of manufacturing hybrid parts comprising metallic and non-metallic materials at high temperature. During the method, a hollow metallic feedstock heated to a temperature in the austenite region may be placed in a die and filled with a non-metallic material in a viscous condition, after which the feedstock in the die is formed and then controlled-cooled to cause hardening of the non-metallic material in the region of contact between the metallic and non-metallic material. Afterwards, the semi-finished product is removed from the die and cooled to room temperature. The rate of cooling may be adjusted to generate compressive stress in the surface layer of the non-metallic material, which reduces the risk of cracking.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Atomic diffusion bonding is carried out using a bonding film comprising a nitride formed at a bonding surface. Operating in a vacuum chamber, a bonding film comprising a nitride is formed on each of flat surfaces of two substrates that each have the flat surface, and, by overlapping the two substrates so the bonding films formed on the two substrates are in contact with each other, the two substrates are joined by the generation of atomic diffusion at a bonding interface between the bonding films.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.