C08F263/00

POSITIVE ELECTRODE COMPOSITION

An object of the present invention is to provide a composition for a positive electrode having high binding properties and high flexibility. A composition for a positive electrode, comprising: a graft copolymer-based resin; a polyvinylidene fluoride-based resin, wherein the graft copolymer-based resin includes a graft copolymer in which a monomer, having (meth)acrylonitrile as a main component, is graft-copolymerized with a polyvinyl alcohol. The graft copolymer-based resin optionally further includes at least one of a (meth)acrylonitrile-based non-graft polymer and a polyvinyl alcohol homopolymer. And, a slurry for a positive electrode comprising the composition. A positive electrode comprising a metal foil and a coating film of the slurry. The composition preferably has a mass ratio of the graft copolymer-based resin and the polyvinylidene fluoride resin, which is: graft copolymer-based resin/polyvinylidene fluoride-based resin=2/8 to 8/2.

POSITIVE ELECTRODE COMPOSITION

An object of the present invention is to provide a composition for a positive electrode having high binding properties and high flexibility. A composition for a positive electrode, comprising: a graft copolymer-based resin; a polyvinylidene fluoride-based resin, wherein the graft copolymer-based resin includes a graft copolymer in which a monomer, having (meth)acrylonitrile as a main component, is graft-copolymerized with a polyvinyl alcohol. The graft copolymer-based resin optionally further includes at least one of a (meth)acrylonitrile-based non-graft polymer and a polyvinyl alcohol homopolymer. And, a slurry for a positive electrode comprising the composition. A positive electrode comprising a metal foil and a coating film of the slurry. The composition preferably has a mass ratio of the graft copolymer-based resin and the polyvinylidene fluoride resin, which is: graft copolymer-based resin/polyvinylidene fluoride-based resin=2/8 to 8/2.

Photocurable resin composition, ink and coating material

The present invention aims to provide a photocurable resin composition capable of constituting a composition having high printability. The present invention relates to a photocurable resin composition containing (A) an allylic polymer produced by polymerization of an allylic compound represented by the following formula (I), and (B) a gelling agent, ##STR00001##
wherein R.sup.1 and R.sup.2 each represent H or CH.sub.3; X represents an a-valent group having an unsubstituted saturated or partially unsaturated four- to eight-membered cyclic structure; and a represents 2 or 3.

Photocurable resin composition, ink and coating material

The present invention aims to provide a photocurable resin composition capable of constituting a composition having high printability. The present invention relates to a photocurable resin composition containing (A) an allylic polymer produced by polymerization of an allylic compound represented by the following formula (I), and (B) a gelling agent, ##STR00001##
wherein R.sup.1 and R.sup.2 each represent H or CH.sub.3; X represents an a-valent group having an unsubstituted saturated or partially unsaturated four- to eight-membered cyclic structure; and a represents 2 or 3.

PHOTOCURABLE RESIN COMPOSITION, INK AND COATING MATERIAL
20190085111 · 2019-03-21 ·

The present invention aims to provide a photocurable resin composition capable of constituting a composition having high printability. The present invention relates to a photocurable resin composition containing (A) an allylic polymer produced by polymerization of an allylic compound represented by the following formula (I), and (B) a gelling agent,

##STR00001##

wherein R.sup.1 and R.sup.2 each represent H or CH.sub.3; X represents an a-valent group having an unsubstituted saturated or partially unsaturated four- to eight-membered cyclic structure; and a represents 2 or 3.

Adhesive compositions for bonding and filling large assemblies
RE046269 · 2017-01-10 · ·

Adhesive composition for bonding and filling large assemblies, including a mixture of about 5 percent to about 75 percent by weight of a thermoplastic polymer, about 0.5 percent to about 35 percent by weight of a polyester resin or vinyl ester resin, and about 20 percent to about 80 percent by weight of an alkyl acrylate or methacrylate monomer.

Adhesive compositions for bonding and filling large assemblies
RE046269 · 2017-01-10 · ·

Adhesive composition for bonding and filling large assemblies, including a mixture of about 5 percent to about 75 percent by weight of a thermoplastic polymer, about 0.5 percent to about 35 percent by weight of a polyester resin or vinyl ester resin, and about 20 percent to about 80 percent by weight of an alkyl acrylate or methacrylate monomer.