The disclosure provides small molecule compounds, polymers, and compositions thereof, as well as methods for preparing such polymers and compositions. Also provided is a method of using the polymers or compositions thereof for binding uric acid or precursor thereof, and/or for treating hyperuricemia, gout, and/or diseases caused by hyperuricemia.

The disclosure provides small molecule compounds, polymers, and compositions thereof, as well as methods for preparing such polymers and compositions. Also provided is a method of using the polymers or compositions thereof for binding uric acid or precursor thereof, and/or for treating hyperuricemia, gout, and/or diseases caused by hyperuricemia.

An aqueous composition including multi-stage latex polymer particles is provided. The multi-stage latex polymer particles include (A) a first-stage polymer containing (i) an ethylenically unsaturated acid monomer with two carboxylic acid groups and (ii) a first vinyl monomer, and (B) a second-stage polymer containing (i) an ethylenically unsaturated monomer with an epoxy group and (ii) a second vinyl monomer. An article including a nonwoven textile impregnated with the aqueous composition is also provided.

An aqueous composition including multi-stage latex polymer particles is provided. The multi-stage latex polymer particles include (A) a first-stage polymer containing (i) an ethylenically unsaturated acid monomer with two carboxylic acid groups and (ii) a first vinyl monomer, and (B) a second-stage polymer containing (i) an ethylenically unsaturated monomer with an epoxy group and (ii) a second vinyl monomer. An article including a nonwoven textile impregnated with the aqueous composition is also provided.

A polymer compound represented by formula (1) in formula (1), R.sub.1 and R.sub.2 each independently represent a hydrogen atom or a methyl group. In formula (1), m and n are average numbers of repeating units, and each independently represent a real number within the range of 1 to 2000. The polymer compound has sufficient flexibility to be able to form a film, exhibits high adhesion to a low roughness copper foil, and has a low dielectric constant and dielectric loss tangent.

##STR00001##

A polymer compound represented by formula (1) in formula (1), R.sub.1 and R.sub.2 each independently represent a hydrogen atom or a methyl group. In formula (1), m and n are average numbers of repeating units, and each independently represent a real number within the range of 1 to 2000. The polymer compound has sufficient flexibility to be able to form a film, exhibits high adhesion to a low roughness copper foil, and has a low dielectric constant and dielectric loss tangent.

##STR00001##

There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group. There is provided a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition. There is provided a multilayer printed wiring board and a semiconductor package. There is further provided a method for producing the multilayer printed wiring board.

There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group. There is provided a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition. There is provided a multilayer printed wiring board and a semiconductor package. There is further provided a method for producing the multilayer printed wiring board.

Polyolefin elastomers are widely employed commodity polymers. There remains a desire to expand the structural diversity of polyolefin elastomers to facilitate their use in additional applications. Polyolefin elastomers may be graft copolymers that comprise: a first polymer chain comprising at least a first olefinic monomer comprising isobutylene and a second olefinic monomer bearing a benzylic carbon atom or an allylic carbon atom, and a second polymer chain bonded to the benzylic carbon atom or the allylic carbon atom of the first polymer chain. The second polymer chain comprises at least one monomer that is not present in the first polymer chain. The second polymer chain may be bonded to the first polymer chain by generating a carbanion upon the benzylic carbon atom or the allylic carbon atom and growing the second polymer chain by anionic polymerization.

Polyolefin elastomers are widely employed commodity polymers. There remains a desire to expand the structural diversity of polyolefin elastomers to facilitate their use in additional applications. Polyolefin elastomers may be graft copolymers that comprise: a first polymer chain comprising at least a first olefinic monomer comprising isobutylene and a second olefinic monomer bearing a benzylic carbon atom or an allylic carbon atom, and a second polymer chain bonded to the benzylic carbon atom or the allylic carbon atom of the first polymer chain. The second polymer chain comprises at least one monomer that is not present in the first polymer chain. The second polymer chain may be bonded to the first polymer chain by generating a carbanion upon the benzylic carbon atom or the allylic carbon atom and growing the second polymer chain by anionic polymerization.