The present invention relates to processes for making compatibilized high aspect ratio barrier additives and polymer compositions that comprise compatibilized high aspect ratio barrier additives. The invention also relates to compositions produced by these processes, and articles formed from polymer compositions of this invention. The barrier additives provide passive barriers to gas molecules such as oxygen and carbon dioxide minimizing transit of such molecules through sidewalls of polymer articles containing the barrier additives.

The present invention relates to processes for making compatibilized high aspect ratio barrier additives and polymer compositions that comprise compatibilized high aspect ratio barrier additives. The invention also relates to compositions produced by these processes, and articles formed from polymer compositions of this invention. The barrier additives provide passive barriers to gas molecules such as oxygen and carbon dioxide minimizing transit of such molecules through sidewalls of polymer articles containing the barrier additives.

Side-chain crystallizable (SCC) polymers are useful in various medical applications. In certain applications, heavy atom containing side-chain crystallizable polymers (HACSCCP's) are particularly useful. An example of a HACSCCP is a polymer that comprises a main chain, a plurality of crystallizable side chains, and a plurality of heavy atoms attached to the polymer. In certain configurations, the heavy atoms are present in an amount that is effective to render the polymer radiopaque. A polymeric material that includes an HACSCCP may be fabricated into a medical device useful for at least partially occluding a body cavity. For example, such a medical device may be an embolotherapy product. A polymeric material that includes a SCC polymer may also be fabricated into other medical devices, such as stents.

Side-chain crystallizable (SCC) polymers are useful in various medical applications. In certain applications, heavy atom containing side-chain crystallizable polymers (HACSCCP's) are particularly useful. An example of a HACSCCP is a polymer that comprises a main chain, a plurality of crystallizable side chains, and a plurality of heavy atoms attached to the polymer. In certain configurations, the heavy atoms are present in an amount that is effective to render the polymer radiopaque. A polymeric material that includes an HACSCCP may be fabricated into a medical device useful for at least partially occluding a body cavity. For example, such a medical device may be an embolotherapy product. A polymeric material that includes a SCC polymer may also be fabricated into other medical devices, such as stents.

The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of below 4 Pas at 150° C., d) at least one of a curing agent D capable of reacting with A, B and optionally C, e) and optionally additional compounds,
wherein the glass transition temperature of the uncured material is at least 30° C., preferably at least 40° C. as measured with DSC at a heating rate of 20° C./min.

The invention further relates to a method of producing a cured 3D thermoset object and the use of the above-mentioned thermosetting material in a 3D printing process.

The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of below 4 Pas at 150° C., d) at least one of a curing agent D capable of reacting with A, B and optionally C, e) and optionally additional compounds,
wherein the glass transition temperature of the uncured material is at least 30° C., preferably at least 40° C. as measured with DSC at a heating rate of 20° C./min.

The invention further relates to a method of producing a cured 3D thermoset object and the use of the above-mentioned thermosetting material in a 3D printing process.

The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

A composition containing a polymer material and a phosphorus-containing flame retardant based on an aminomethyl bisphosphonate, a process for the production of the composition, and the use of the flame retardant as well as selected structures of the flame retardant are disclosed.

A composition containing a polymer material and a phosphorus-containing flame retardant based on an aminomethyl bisphosphonate, a process for the production of the composition, and the use of the flame retardant as well as selected structures of the flame retardant are disclosed.