Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

A process for manufacturing a masterbatch comprises the following steps: (a) bringing at least one initial polymer comprising at least one carbon-carbon unsaturation into contact with at least one 1,3-dipolar grafting agent bearing at least one nitrile oxide dipole in the presence of at least one organophosphorus additive selected from the group consisting of phosphoric acid triesters, phosphonates, phosphinates, phosphine oxides and the mixtures of these compounds, and (b) recovering the masterbatch obtained in the preceding step. The masterbatch and compositions containing it and also tires comprising such compositions are also disclosed.

A rubber composition that is based upon a cross-linkable elastomer composition comprising, per 100 parts by weight of rubber (phr) between 70 phr and 100 phr of an epoxidized rubber component selected from an epoxidized polybutadiene rubber (eBR), an epoxidized styrene-butadiene rubber (eSBR), or combinations thereof, wherein the epoxidized rubber component has a Tg of between −80° C. and −110° C. and an epoxy-function content of between 1 mol % and 25 mol %; between 30 phr and 150 phr of a plasticizing resin; and a quickly reactive silica that provides a macro dispersion Z-value of at least 50 in a defined rubber composition; and a non-silol coupling agent.

Provided is a novel resin composition for a metal-clad laminate, with which a metal-clad laminate having excellent adhesion with a metal foil, solder heat resistance, insulation and the like can be produced. A terminally modified polybutadiene contained in the resin composition for a metal-clad laminate according to the present invention has a structure of formula (III) on each of both terminals of a polybutadiene comprising a repeating unit of formula (I) and a repeating unit of formula (II), wherein a proportion of the repeating unit of formula (I) in all the repeating units is 70 to 99% by mol.

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Golf ball comprising a core, an outer layer and at least one adhesion promoting coating disposed between each of the core and the outer layer; the core comprising a rubber composition comprising at least one zinc-containing and/or magnesium-containing component; the outer layer comprising at least one ionomer; and the adhesion promoting coating comprising a waterborne dispersion comprised of at least one ethylene acid copolymer having an acid content of at least 15% by weight wherein the copolymer is at least partially neutralized with one or more neutralizing agent; wherein at least one neutralizing agent is selected from ammonia compounds and/or amine compounds. In a specific embodiment, the at least one neutralizing agent comprises i) mono and/or divalent metal compounds and ii) ammonia compounds and/or amine compounds.

Methods for treating a cured inner liner as well as treated, cured inner liners resulting from such methods are disclosed. Also disclosed are tires containing the treated inner liners. The methods include treatment of the lower surface of inner liner surface with a rubber-containing liquid to produce a rubber-containing film thereupon.

A medical rubber composition can contain, comprise, consist, or consist essentially of: (a) an isobutylene-isoprene rubber: (b) a diene-based rubber; and a silica having a BET specific surface area not lower than 130 m.sup.2/g. An amount of (a) the isobutylene-isoprene rubber contained in 100 parts by mass of a rubber component composed of (a) the isobutylene-isoprene rubber and (b) the diene-based rubber can be larger than 30 parts by mass and smaller than 55 parts by mass.

A polymeric composition includes a diene elastomer; an azodicarboxy compound; and a reinforcing filler comprising silica. The composition is not foamed. A method for preparing a polymeric composition includes mixing in one or more steps: a diene elastomer; an azodicarboxy compound; and a reinforcing filler. The mixing temperature is less than 160° C. in mixing steps in which the azodicarboxy compound is present. In an embodiment, the mixing temperature is kept below the decomposition temperature of the azodicarboxy compound.

A foam containing a nitrile group-containing conjugated diene copolymer and a urethane polymer, wherein relative to 100 wt % of the sum of the nitrile group-containing conjugated diene copolymer and the urethane polymer, the nitrile group-containing conjugated diene copolymer is present in an amount of less than 90 wt % and the urethane polymer is present in an amount of more than 10 wt %, the nitrile group-containing conjugated diene copolymer contains ethylenically unsaturated nitrile monomer units in an amount of more than 31 wt %, the foam has a density of 0.08 to 0.30 g/cm.sup.3, and in observation of an arbitrary cross section of the foam, air bubble cross sections present in the cross section have an average diameter of 350 μm or less, and the number of air bubble cross sections with a diameter of 0.6 mm or more present in the cross section is 0.062 per mm.sup.2 or less.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.