Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 μm to 6,500 μm. A shaped polymeric article comprising the polymeric substrate is also disclosed.

A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 μm to 6,500 μm. A shaped polymeric article comprising the polymeric substrate is also disclosed.

The present application relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation film having excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending, while preventing generation of bright spots in the organic electronic device.

A resin composition, including resin and imidazole, is provided. The resin includes cyanate ester resin and bismaleimide resin, and the imidazole does not have acidic hydrogen.

A functional fabric and a method for manufacturing the same are provided. The functional fabric includes a polyurethane resin matrix and a plastic optical molding material. In the functional fabric, a content of the polyurethane resin matrix is between 48 wt % and 95 wt %, and a content of the plastic optical molding material is between 5 wt % and 50 wt %. The functional fabric further includes an ultraviolet absorber, an antioxidant additive, and an antibacterial additive. The functional fabric satisfies following test standards: (1) reaching level 4 of a phenolic yellowing test; (2) passing at least 60 hours of a QUV (ASTM G154) test; (3) passing at least four weeks of a water decomposition resistance test under the test conditions of 70° C. and 95% relative humidity; and (4) passing at least one certification of Global Recycle Standard (GRS) and Recycled Claim Standard (RCS).

The present invention is directed to film-forming compositions comprising: a) a non-chlorinated, linear polyolefin polymer comprising 0.5 to 10 percent by weight residues of an ethylenically unsaturated anhydride or acid; b) an aminoplast; and c) a component comprising: i) at least one non-chlorinated hydrocarbon having at least 18 carbon atoms and optionally aromatic groups and/or oxygen heteroatoms; and/or ii) an alkyd resin. The present invention is also drawn to methods of improving fuel resistance of a coated article, comprising: (1) applying the film-forming composition to a substrate to form a coated substrate; (2) optionally subjecting the coated substrate to a temperature for a time sufficient to cure the film-forming composition; (3) applying at least one curable film-forming composition to the coated substrate to form a multi-layer coated substrate; and (4) subjecting the multi-layer coated substrate to a temperature and for a time sufficient to cure all of the film-forming compositions.

A resin composition contains an epoxy compound, a maleimide compound, a phenolic compound, core-shell rubber, and an inorganic filler. The maleimide compound has an N-phenyl maleimide structure. The content of the maleimide compound falls within a range from 10 parts by mass to less than 40 parts by mass with respect to 100 parts by mass in total of the epoxy compound, the maleimide compound, and the phenolic compound.

A film, preferably, a multi-layered film, comprising a polymer composition, wherein the polymer composition comprises: within a range from 1 wt % to 25 wt % of a cyclic olefin copolymer based on the weight of the polymer composition, and within a range from 75 wt % to 99 wt % (the remainder of material) of a polyethylene based on the weight of the polymer composition, wherein the cyclic olefin copolymer has a glass transition temperature (T.sub.g) of at least 80° C. The films may be used in shrink packaging application.

The invention discloses a concentrate comprising cyclic olefin polymer and titanium dioxide, a compound formulation, a process for preparing coloured polyester, a process for preparing polyester-based containers, and a container product. The concentrate of the invention comprises 10-90% by total weight of the concentrate of cyclic olefin polymer, and 20-80% by total weight of the concentrate of titanium dioxide.