A liquid repellent structure includes a surface to which liquid repellency is to be imparted, and a liquid repellent layer formed on the surface. In the structure: the liquid repellent layer contains a binder resin containing a fluorine-containing resin, and a filler dispersed in the binder resin; the filler contains a first filler having a BET specific surface area M of 100 m.sup.2/g to 400 m.sup.2/g; and the ratio M/F of the BET specific surface area M of the first filler to a mass F (mass %) of the fluorine-containing resin relative to the total mass of the liquid repellent layer is 4.1 to 20.0.

A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 μm or more, the diameter at the second is ⅔ or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.

A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 μm or more, the diameter at the second is ⅔ or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.

A heat dissipation sheet having excellent thermal conductance, is a molded thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, wherein the inorganic filler component particle size distribution includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler; the particle size at the first maximum point is 15 μm or more; the particle size at the second maximum point is ⅔ or less the particle size at the first maximum point; and an accumulated amount of the frequency between the peak start and the peak end of the peak having the first maximum point is 50% or more, and which has a surface roughness of from 1.5 to 3.0 μm and a thickness of 0.2 mm or less.

A heat dissipation sheet having excellent thermal conductance, is a molded thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, wherein the inorganic filler component particle size distribution includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler; the particle size at the first maximum point is 15 μm or more; the particle size at the second maximum point is ⅔ or less the particle size at the first maximum point; and an accumulated amount of the frequency between the peak start and the peak end of the peak having the first maximum point is 50% or more, and which has a surface roughness of from 1.5 to 3.0 μm and a thickness of 0.2 mm or less.

An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.

A method for improving corrosion resistance of vinyl ester resin is provided, which belongs to the technical field of polymer materials. The method includes adding vinyl ester resin into a MXene nanosheet solution and evaporating the solvent; then adding cobalt isooctoate promoter and butanone peroxide initiator in sequence, standing for curing after defoaming, and then heating.

A method for improving corrosion resistance of vinyl ester resin is provided, which belongs to the technical field of polymer materials. The method includes adding vinyl ester resin into a MXene nanosheet solution and evaporating the solvent; then adding cobalt isooctoate promoter and butanone peroxide initiator in sequence, standing for curing after defoaming, and then heating.

Described herein is a cast elastomer including graphene nano platelets and a process for preparing the same.

Described herein is a cast elastomer including graphene nano platelets and a process for preparing the same.