Patent classifications
C08L45/00
THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.
THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.
MODIFIED CONJUGATED DIENE-BASED POLYMER, METHOD FOR PREPARING THE SAME AND RUBBER COMPOSITION COMPRISING THE SAME
The present disclosure relates to a modified conjugated diene-based polymer, a method for preparing the same and a rubber composition comprising the same, and the modified conjugated diene-based polymer has narrow molecular weight distribution, and includes S atoms in the specific content in the polymer, a derived unit from an N-containing aromatic hydrocarbon compound, a derived unit from an S-containing aromatic hydrocarbon compound or an S-containing heterocyclic compound.
MODIFIED CONJUGATED DIENE-BASED POLYMER, METHOD FOR PREPARING THE SAME AND RUBBER COMPOSITION COMPRISING THE SAME
The present disclosure relates to a modified conjugated diene-based polymer, a method for preparing the same and a rubber composition comprising the same, and the modified conjugated diene-based polymer has narrow molecular weight distribution, and includes S atoms in the specific content in the polymer, a derived unit from an N-containing aromatic hydrocarbon compound, a derived unit from an S-containing aromatic hydrocarbon compound or an S-containing heterocyclic compound.
Resist composition and patterning process
A chemically-amplified negative resist composition includes: (A) a quencher containing an onium salt shown by the following formula (A-1); (B) a base polymer containing repeating units shown by the following formulae (B1) and (B2); and (C) a photo-acid generator which generates an acid. Thus, the present invention provides: a negative resist composition which can form a favorable profile with high sensitivity and low LWR and CDU in a pattern; and a resist patterning process using the composition. ##STR00001##
Resist composition and patterning process
A chemically-amplified negative resist composition includes: (A) a quencher containing an onium salt shown by the following formula (A-1); (B) a base polymer containing repeating units shown by the following formulae (B1) and (B2); and (C) a photo-acid generator which generates an acid. Thus, the present invention provides: a negative resist composition which can form a favorable profile with high sensitivity and low LWR and CDU in a pattern; and a resist patterning process using the composition. ##STR00001##
TIRE
A tire having excellent wet grip performance and low rolling resistance is provided. This tire is a tire obtained by using a rubber composition that includes a rubber component containing a rubber having an isoprene structure and an aminoalkoxysilane-modified styrene-butadiene rubber having an amount of bonded styrene of 15% or less; a filler containing a silica having a nitrogen adsorption specific surface area (BET method) of 130 m.sup.2/g or more and less than 330 m.sup.2/g, the amount of the filler being 40 to 125 parts by mass with respect to 100 parts by mass of the rubber component; and a hydrogenated resin having a softening point of higher than 110° C. and having a weight average molecular weight as converted to polystyrene of 200 to 1200 g/mol, the amount of the hydrogenated resin being 5 to 50 parts by mass per 100 parts by mass of the rubber component.
TIRE
A tire having excellent wet grip performance and low rolling resistance is provided. This tire is a tire obtained by using a rubber composition that includes a rubber component containing a rubber having an isoprene structure and an aminoalkoxysilane-modified styrene-butadiene rubber having an amount of bonded styrene of 15% or less; a filler containing a silica having a nitrogen adsorption specific surface area (BET method) of 130 m.sup.2/g or more and less than 330 m.sup.2/g, the amount of the filler being 40 to 125 parts by mass with respect to 100 parts by mass of the rubber component; and a hydrogenated resin having a softening point of higher than 110° C. and having a weight average molecular weight as converted to polystyrene of 200 to 1200 g/mol, the amount of the hydrogenated resin being 5 to 50 parts by mass per 100 parts by mass of the rubber component.
RUBBER COMPOSITION AND TIRE
A rubber composition includes: a rubber component; a filler in an amount of 40 to 125 parts by mass per 100 parts by mass of the rubber component; and a hydrogenated resin in an amount of 5 to 50 parts by mass per 100 parts by mass of the rubber component, the resin having a softening point of higher than 110° C. and a weight average molecular weight, as determined in terms of polystyrene, of 200 to 1200 g/mol. The rubber composition can be used to produce a tire having an excellent wet grip performance and a low rolling resistance, and a vulcanized rubber having excellent handling properties.
RUBBER COMPOSITION AND TIRE
A rubber composition includes: a rubber component; a filler in an amount of 40 to 125 parts by mass per 100 parts by mass of the rubber component; and a hydrogenated resin in an amount of 5 to 50 parts by mass per 100 parts by mass of the rubber component, the resin having a softening point of higher than 110° C. and a weight average molecular weight, as determined in terms of polystyrene, of 200 to 1200 g/mol. The rubber composition can be used to produce a tire having an excellent wet grip performance and a low rolling resistance, and a vulcanized rubber having excellent handling properties.