Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

A heterogeneous vulcanized polymer blend comprising a continuous phase comprising a thermoplastic polypropylene having a crystallinity of at least 30% and a dispersed phase comprising particles of an elastomeric copolymer dispersed in the continuous phase and having an average particle size of less than 5 micron. The elastomeric copolymer has a crystallinity of less than 20% and is at least partially cross-linked such that no more than about 80 wt % of the elastomeric copolymer is extractable in cyclohexane at 23° C.

A heterogeneous vulcanized polymer blend comprising a continuous phase comprising a thermoplastic polypropylene having a crystallinity of at least 30% and a dispersed phase comprising particles of an elastomeric copolymer dispersed in the continuous phase and having an average particle size of less than 5 micron. The elastomeric copolymer has a crystallinity of less than 20% and is at least partially cross-linked such that no more than about 80 wt % of the elastomeric copolymer is extractable in cyclohexane at 23° C.

The present invention relates to the synthesis of polymer polyols in unsaturated polyols as liquid phase, polymer polyols and their use.

The present invention relates to the synthesis of polymer polyols in unsaturated polyols as liquid phase, polymer polyols and their use.

In a first aspect, the present invention is directed to a rubber composition comprising 70 phr to 90 phr of styrene butadiene rubber, wherein said styrene butadiene rubber comprises a first styrene butadiene rubber having a glass transition temperature within a range of −49° C. to −15° C. and a second styrene butadiene rubber having a glass transition temperature within a range of −50° C. to −89° C. Furthermore, the rubber composition comprises from 10 phr to 30 phr of one or more of natural rubber and synthetic polyisoprene rubber, 100 phr to 200 phr of silica, and at least 25 phr of at least one terpene resin having a weight average molecular weight (Mw) of at most 1000 g/mol. Moreover, the invention is directed to a tire comprising such a rubber composition, in particular in the tread of the tire.

In a first aspect, the present invention is directed to a rubber composition comprising 70 phr to 90 phr of styrene butadiene rubber, wherein said styrene butadiene rubber comprises a first styrene butadiene rubber having a glass transition temperature within a range of −49° C. to −15° C. and a second styrene butadiene rubber having a glass transition temperature within a range of −50° C. to −89° C. Furthermore, the rubber composition comprises from 10 phr to 30 phr of one or more of natural rubber and synthetic polyisoprene rubber, 100 phr to 200 phr of silica, and at least 25 phr of at least one terpene resin having a weight average molecular weight (Mw) of at most 1000 g/mol. Moreover, the invention is directed to a tire comprising such a rubber composition, in particular in the tread of the tire.

The present disclosure provides a tire which makes it possible to reduce the increase in hardness and the decrease in wet grip performance from before to after heat aging. The present disclosure relates to a tire including a tread, the tread including an elastomer composition containing a styrene elastomer and urethane particles, the tread satisfying the following relationship (1): (M100a−M100f)/M100f×100≤38 wherein M100f represents the stress at 100% elongation (23° C.) before heat aging, and M100a represents the stress at 100% elongation (23° C.) after heat aging.

The present disclosure provides a tire which makes it possible to reduce the increase in hardness and the decrease in wet grip performance from before to after heat aging. The present disclosure relates to a tire including a tread, the tread including an elastomer composition containing a styrene elastomer and urethane particles, the tread satisfying the following relationship (1): (M100a−M100f)/M100f×100≤38 wherein M100f represents the stress at 100% elongation (23° C.) before heat aging, and M100a represents the stress at 100% elongation (23° C.) after heat aging.