Provided are a curing accelerator for an oxidative polymerization type unsaturated resin having a high curing accelerating ability, and a printing ink and a coating material each including the curing accelerator for an oxidative polymerization type unsaturated resin. Specifically, there are provided a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A), a ligand compound (C) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal complex (D) and an imidazole compound (B), and a printing ink and a coating material using the curing accelerator for an oxidative polymerization type unsaturated resin.

Provided are a curing accelerator for an oxidative polymerization type unsaturated resin having a high curing accelerating ability, and a printing ink and a coating material each including the curing accelerator for an oxidative polymerization type unsaturated resin. Specifically, there are provided a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A), a ligand compound (C) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal complex (D) and an imidazole compound (B), and a printing ink and a coating material using the curing accelerator for an oxidative polymerization type unsaturated resin.

In a pneumatic tire in which a reinforcing layer including a cord is embedded, a coating rubber covering the cord included in the reinforcing layer uses a rubber composition in which 30 parts by mass to 60 parts by mass of carbon black having a nitrogen adsorption specific surface area N.sub.2SA of 100 m.sup.2/g or more and 0 parts by mass or more and 10 parts by mass or less of aroma oil is optionally blended, per 100 parts by mass of a rubber component containing 70 mass % to 100 mass % of a natural rubber and in which a strength at break TB (unit: MPa) at 100° C. and a stress M100 (unit: MPa) at 100% elongation at 100° C. satisfy a relationship TB.sup.2/M100≥50.0.

In a pneumatic tire in which a reinforcing layer including a cord is embedded, a coating rubber covering the cord included in the reinforcing layer uses a rubber composition in which 30 parts by mass to 60 parts by mass of carbon black having a nitrogen adsorption specific surface area N.sub.2SA of 100 m.sup.2/g or more and 0 parts by mass or more and 10 parts by mass or less of aroma oil is optionally blended, per 100 parts by mass of a rubber component containing 70 mass % to 100 mass % of a natural rubber and in which a strength at break TB (unit: MPa) at 100° C. and a stress M100 (unit: MPa) at 100% elongation at 100° C. satisfy a relationship TB.sup.2/M100≥50.0.

The present invention relates to a bio-based polyelectrolyte complex (PEC) composition suitable as a binder for fiber based materials, textiles, woven and nonwoven materials, said PEC composition comprising cationic biopolymer, anionic biopolymer, acid and preservative, and wherein the net charge of the PEC is cationic, the charge ratio of the anionic polymer and the cationic polymer is ≤1, the cationic biopolymer is chitosan, the anionic biopolymer is a polyanion derived from nature, the acid is a Brønsted acid and/or a Lewis acid, wherein the Brønsted acid is selected from any organic and/or inorganic acids, and wherein the Lewis acid is selected from any cationic mono- or multivalent atom, the weight ratio between cation and anion is 1:0.1 to 1:20, the weight ratio between the cation and acid is 1:0.01 to 1:30, chitosan has a degree of deacetylation being 66-100%, the pH is less than 7, and wherein said composition further comprises one or more non-water soluble particles. The present invention further relates to a method for preparing the PEC composition, uses of the PEC composition, as well as method of treating materials with the PEC composition.

An object of the present invention is to provide cellulose acetate that has excellent compatibility with a resin, can reinforce a resin, and has excellent thermal stability. An embodiment of the present invention is cellulose acetate having a cellulose triacetate I crystal structure, wherein a temperature at which a weight loss relative to weight at 100° C. reaches 5% is 200° C. or higher when the cellulose acetate is heated at a heating rate of 10° C./min under a nitrogen atmosphere.

An object of the present invention is to provide cellulose acetate that has excellent compatibility with a resin, can reinforce a resin, and has excellent thermal stability. An embodiment of the present invention is cellulose acetate having a cellulose triacetate I crystal structure, wherein a temperature at which a weight loss relative to weight at 100° C. reaches 5% is 200° C. or higher when the cellulose acetate is heated at a heating rate of 10° C./min under a nitrogen atmosphere.

An adhesive-backed film with an adhesive layer having thermoplastic or thermoset filaments partially projecting therefrom, to promote fluid egress and repositionability.

An adhesive-backed film with an adhesive layer having thermoplastic or thermoset filaments partially projecting therefrom, to promote fluid egress and repositionability.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.