A thermally conductive filler capable of exhibiting high thermal conductive properties with its specific gravity being reduced, a thermally conductive composite material and a wire harness that contains such a thermally conductive filler, and a method for forming a thermally conductive filler that can be used to form such a thermally conductive filler. A thermally conductive filler includes a hollow particle having a polar group on its surface, and a thermally conductive layer containing an inorganic compound that covers the surface of the hollow particle. Also, a thermally conductive composite material contains the thermally conductive filler and a matrix material, the thermally conductive filler being dispersed in the matrix material. Furthermore, a wire harness contains the thermally conductive composite material.

A thermally conductive filler capable of exhibiting high thermal conductive properties with its specific gravity being reduced, a thermally conductive composite material and a wire harness that contains such a thermally conductive filler, and a method for forming a thermally conductive filler that can be used to form such a thermally conductive filler. A thermally conductive filler includes a hollow particle having a polar group on its surface, and a thermally conductive layer containing an inorganic compound that covers the surface of the hollow particle. Also, a thermally conductive composite material contains the thermally conductive filler and a matrix material, the thermally conductive filler being dispersed in the matrix material. Furthermore, a wire harness contains the thermally conductive composite material.

The present invention provides a UV-curable pressure-sensitive adhesive composition, comprising: 81 to 97.5 parts of (meth)acrylate polymer having a carboxyl functional group by weight, the amount of the carboxyl functional group in the (meth)acrylate polymer having the carboxyl functional group being equal to or greater than 40 mmol/100 g; 2.5 to 19 parts of an epoxy resin by weight; 0.3 to 6 parts of a polyol by weight; and 0.05 to 5 parts of a photoinitiator by weight. The UV-curable pressure-sensitive adhesive composition has good anti-repulsion. The present invention further provides a UV-curable adhesive tape comprising the UV-curable pressure-sensitive adhesive composition.

The present invention provides a UV-curable pressure-sensitive adhesive composition, comprising: 81 to 97.5 parts of (meth)acrylate polymer having a carboxyl functional group by weight, the amount of the carboxyl functional group in the (meth)acrylate polymer having the carboxyl functional group being equal to or greater than 40 mmol/100 g; 2.5 to 19 parts of an epoxy resin by weight; 0.3 to 6 parts of a polyol by weight; and 0.05 to 5 parts of a photoinitiator by weight. The UV-curable pressure-sensitive adhesive composition has good anti-repulsion. The present invention further provides a UV-curable adhesive tape comprising the UV-curable pressure-sensitive adhesive composition.

The composition includes a polyester resin comprising at least one α,β-unsaturated ester group, an epoxy resin, a compound comprising at least one hydroxyl group; and a photoinitiator that generates acid on exposure to actinic radiation. A method of repairing a damaged surface using the composition is also described.

The composition includes a polyester resin comprising at least one α,β-unsaturated ester group, an epoxy resin, a compound comprising at least one hydroxyl group; and a photoinitiator that generates acid on exposure to actinic radiation. A method of repairing a damaged surface using the composition is also described.

In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

The present invention addresses the problem of providing a prepreg that yields a carbon fiber composite material that has exceptional tensile strength, heat resistance, and impact resistance and is suitable as a structural material of an aircraft body, wherein the resin composition used in the prepreg furthermore has exceptional viscosity stability, the prepreg containing a resin composition that contains carbon fibers and at least the constituent elements [A]—[D] as defined.

The present invention addresses the problem of providing a prepreg that yields a carbon fiber composite material that has exceptional tensile strength, heat resistance, and impact resistance and is suitable as a structural material of an aircraft body, wherein the resin composition used in the prepreg furthermore has exceptional viscosity stability, the prepreg containing a resin composition that contains carbon fibers and at least the constituent elements [A]—[D] as defined.