A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone having monovalent aromatic hydrocarbon groups; and (C) a cationic photoinitiator. Optionally, the composition further comprises (D) an epoxy-functional silicone free of monovalent aromatic hydrocarbon groups. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent transparency and mechanical properties.

A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone having monovalent aromatic hydrocarbon groups; and (C) a cationic photoinitiator. Optionally, the composition further comprises (D) an epoxy-functional silicone free of monovalent aromatic hydrocarbon groups. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent transparency and mechanical properties.

A curable silicone adhesive composition comprising a combination of adhesion promoters is shown and described herein. The composition includes a first adhesion promoter selected from a silicon hydride adhesion promoter and a second adhesion promoter selected from an acrylate functional adhesion promoter to provide a silicone material that is curable at relatively low temperatures and shorter time and provides good adhesion to plastics and metal.

A curable silicone adhesive composition comprising a combination of adhesion promoters is shown and described herein. The composition includes a first adhesion promoter selected from a silicon hydride adhesion promoter and a second adhesion promoter selected from an acrylate functional adhesion promoter to provide a silicone material that is curable at relatively low temperatures and shorter time and provides good adhesion to plastics and metal.

A pressure sensitive adhesive (PSA) composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated group per molecule. The PSA composition further comprises (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule. In addition, the PSA composition comprises (C) a hydrosilylation-reaction catalyst. The (A) silicate resin is miscible in the PSA composition in the absence of any solvent. The PSA composition can be at least partially cured to give a PSA.

A pressure sensitive adhesive (PSA) composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated group per molecule. The PSA composition further comprises (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule. In addition, the PSA composition comprises (C) a hydrosilylation-reaction catalyst. The (A) silicate resin is miscible in the PSA composition in the absence of any solvent. The PSA composition can be at least partially cured to give a PSA.

A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically unsaturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically unsaturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically un saturated groups per molecule. The (A) silicate resin is miscible with the (B) organopolysiloxane in the absence of any solvent. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically un saturated groups per molecule. The (A) silicate resin is miscible with the (B) organopolysiloxane in the absence of any solvent. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.