A pattern-forming method includes applying a first composition on a surface layer of a substrate to form a first coating film. The surface layer includes a first region which includes a metal atom, and a second region which includes a silicon atom. The first coating film is heated. A portion other than a portion formed on the first region or a portion other than a portion formed on the second region of the first coating film heated is removed, thereby forming a first lamination portion. A second composition is applied on the substrate on which the first lamination portion is formed to form a second coating film. The second coating film is heated or exposed. A portion other than a portion formed on the first lamination portion of the second coating film heated or exposed is removed, thereby forming a second lamination portion.

A pattern-forming method includes applying a first composition on a surface layer of a substrate to form a first coating film. The surface layer includes a first region which includes a metal atom, and a second region which includes a silicon atom. The first coating film is heated. A portion other than a portion formed on the first region or a portion other than a portion formed on the second region of the first coating film heated is removed, thereby forming a first lamination portion. A second composition is applied on the substrate on which the first lamination portion is formed to form a second coating film. The second coating film is heated or exposed. A portion other than a portion formed on the first lamination portion of the second coating film heated or exposed is removed, thereby forming a second lamination portion.

A polymer, an organic layer composition, and a method of forming patterns, the polymer including a structural unit represented by Chemical Formula 1 or Chemical Formula 2:

##STR00001##

A pattern-forming method includes applying a first composition on a surface layer of a substrate to form a first coating film. The surface layer includes a first region which includes a metal atom, and a second region which includes a silicon atom. The first coating film is heated. A portion other than a portion formed on the first region or a portion other than a portion formed on the second region of the first coating film heated is removed, thereby forming a first lamination portion. A second composition is applied on the substrate on which the first lamination portion is formed to form a second coating film. The second coating film is heated or exposed. A portion other than a portion formed on the first lamination portion of the second coating film heated or exposed is removed, thereby forming a second lamination portion.

A method for producing elliptical, needle-shaped, or rod-shaped polymer particles satisfying (1)-(3) below includes a step in which a synthesis solution including water, a mixed solvent of a hydrophilic organic solvent and a hydrophobic organic solvent, a polymeric stabilizer, a polymerization initiator, and an unsaturated monomer is heated, and, at least after the heating has started, the pH of the synthesis solution is adjusted to 5-9 inclusive to perform solution polymerization: (1) the average (L.sub.AV) length (L) in a two-dimensional projection diagram obtained by irradiating the particles with light from a direction orthogonal to the longitudinal direction is 0.1-80 m; (2) the average (D.sub.AV) breadth (D) in the two-dimensional projection diagram obtained by irradiating the particles with light from the direction orthogonal to the longitudinal direction is 0.05-40 m; and (3) the average (P.sub.AV) aspect ratio (L/D) calculated from the length (L) and the breadth (D) is 1.5-30.

A method for producing elliptical, needle-shaped, or rod-shaped polymer particles satisfying (1)-(3) below includes a step in which a synthesis solution including water, a mixed solvent of a hydrophilic organic solvent and a hydrophobic organic solvent, a polymeric stabilizer, a polymerization initiator, and an unsaturated monomer is heated, and, at least after the heating has started, the pH of the synthesis solution is adjusted to 5-9 inclusive to perform solution polymerization: (1) the average (L.sub.AV) length (L) in a two-dimensional projection diagram obtained by irradiating the particles with light from a direction orthogonal to the longitudinal direction is 0.1-80 m; (2) the average (D.sub.AV) breadth (D) in the two-dimensional projection diagram obtained by irradiating the particles with light from the direction orthogonal to the longitudinal direction is 0.05-40 m; and (3) the average (P.sub.AV) aspect ratio (L/D) calculated from the length (L) and the breadth (D) is 1.5-30.

A polymer, an organic layer composition, and a method of forming patterns, the polymer including a structural unit represented by Chemical Formula 1 or Chemical Formula 2:

##STR00001##

A method for producing elliptical, needle-shaped, or rod-shaped polymer particles satisfying (1)-(3) below includes a step in which a synthesis solution including water, a mixed solvent of a hydrophilic organic solvent and a hydrophobic organic solvent, a polymeric stabilizer, a polymerization initiator, and an unsaturated monomer is heated, and, at least after the heating has started, the pH of the synthesis solution is adjusted to 5-9 inclusive to perform solution polymerization: (1) the average (L.sub.AV) length (L) in a two-dimensional projection diagram obtained by irradiating the particles with light from a direction orthogonal to the longitudinal direction is 0.1-80 ?m; (2) the average (D.sub.AV) breadth (D) in the two-dimensional projection diagram obtained by irradiating the particles with light from the direction orthogonal to the longitudinal direction is 0.05-40 ?m; and (3) the average (P.sub.AV) aspect ratio (L/D) calculated from the length (L) and the breadth (D) is 1.5-30.

A pattern-forming method includes applying a first composition on a surface layer of a substrate to form a first coating film. The surface layer includes a first region which includes a metal atom, and a second region which includes a silicon atom. The first coating film is heated. A portion other than a portion formed on the first region or a portion other than a portion formed on the second region of the first coating film heated is removed, thereby forming a first lamination portion. A second composition is applied on the substrate on which the first lamination portion is formed to form a second coating film. The second coating film is heated or exposed. A portion other than a portion formed on the first lamination portion of the second coating film heated or exposed is removed, thereby forming a second lamination portion.

A pattern-forming method includes applying a first composition on a surface layer of a substrate to form a first coating film. The surface layer includes a first region which includes a metal atom, and a second region which includes a silicon atom. The first coating film is heated. A portion other than a portion formed on the first region or a portion other than a portion formed on the second region of the first coating film heated is removed, thereby forming a first lamination portion. A second composition is applied on the substrate on which the first lamination portion is formed to form a second coating film. The second coating film is heated or exposed. A portion other than a portion formed on the first lamination portion of the second coating film heated or exposed is removed, thereby forming a second lamination portion.