C09D149/00

REACTIVE OLIGOMERS, ADDITIVE MANUFACTURING METHODS, AND ARTICLES THEREOF
20220380495 · 2022-12-01 ·

A reactive oligomer has a backbone derived from at least one of polyamideimide, polyimide, polyetherimide, polyaryletherketone, polyethersulfone, polyphenylene sulfide, polyamide, polyester, polyarylate, polyesteramide, polycarbonate, polybenzoxazole or polybenzimidazole and functionalized with at least one unreacted functional group capable of thermal chain extension and crosslinking after formation of the reactive oligomer, wherein the reactive oligomer has an M.sub.n of about 250 to about 10,000 g/mol, calculated using the Carothers equation. Compositions comprising the reactive oligomer have at least one other component that includes a second reactive oligomer, an oligomer lacking unreacted functional groups capable of thermal chain extension and crosslinking, a thermoplastic polymer, a thermoplastic polymer having the same backbone repeat units as the reactive oligomer, a filler, or an additive. A method of manufacture of an article comprises heating a composition comprising the reactive oligomer at a sufficient temperature and time to shape and crosslink the reactive oligomer, including additive manufacturing.

REACTIVE OLIGOMERS, ADDITIVE MANUFACTURING METHODS, AND ARTICLES THEREOF
20220380495 · 2022-12-01 ·

A reactive oligomer has a backbone derived from at least one of polyamideimide, polyimide, polyetherimide, polyaryletherketone, polyethersulfone, polyphenylene sulfide, polyamide, polyester, polyarylate, polyesteramide, polycarbonate, polybenzoxazole or polybenzimidazole and functionalized with at least one unreacted functional group capable of thermal chain extension and crosslinking after formation of the reactive oligomer, wherein the reactive oligomer has an M.sub.n of about 250 to about 10,000 g/mol, calculated using the Carothers equation. Compositions comprising the reactive oligomer have at least one other component that includes a second reactive oligomer, an oligomer lacking unreacted functional groups capable of thermal chain extension and crosslinking, a thermoplastic polymer, a thermoplastic polymer having the same backbone repeat units as the reactive oligomer, a filler, or an additive. A method of manufacture of an article comprises heating a composition comprising the reactive oligomer at a sufficient temperature and time to shape and crosslink the reactive oligomer, including additive manufacturing.

Graphene-enabled anti-corrosion coating

Provided is a graphene-based aqueous coating suspension comprising multiple graphene sheets, particles of an anti-corrosive pigment or sacrificial metal, and a waterborne binder resin dissolved or dispersed in water, wherein the multiple graphene sheets contain single-layer or few-layer graphene sheets selected from a pristine graphene material having essentially zero % of non-carbon elements, or a non-pristine graphene material having 0.001% to 47% by weight of non-carbon elements wherein the non-pristine graphene is selected from graphene oxide, reduced graphene oxide, graphene fluoride, graphene chloride, graphene bromide, graphene iodide, hydrogenated graphene, nitrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof and wherein the coating suspension does not contain a silicate binder or microspheres dispersed therein. Also provided is an object or structure coated at least in part with such a coating.

Graphene-enabled anti-corrosion coating

Provided is a graphene-based aqueous coating suspension comprising multiple graphene sheets, particles of an anti-corrosive pigment or sacrificial metal, and a waterborne binder resin dissolved or dispersed in water, wherein the multiple graphene sheets contain single-layer or few-layer graphene sheets selected from a pristine graphene material having essentially zero % of non-carbon elements, or a non-pristine graphene material having 0.001% to 47% by weight of non-carbon elements wherein the non-pristine graphene is selected from graphene oxide, reduced graphene oxide, graphene fluoride, graphene chloride, graphene bromide, graphene iodide, hydrogenated graphene, nitrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof and wherein the coating suspension does not contain a silicate binder or microspheres dispersed therein. Also provided is an object or structure coated at least in part with such a coating.

Aqueous Resin Based Inkjet Ink
20230174804 · 2023-06-08 · ·

An aqueous inkjet ink comprises a compound functionalized with at least two functional groups selected from the group consisting of a primary amine and a secondary amine, a colorant and a polymeric particle comprising an oligomer or polymer having at least 3 repeating units comprising a functional group according to general formula I, II or III general formula I general formula II general formula III

##STR00001##

Resonant sensor

An object of the present invention is to provide a resonant sensor having excellent sensitivity and selectivity with respect to a component to be detected that is contained at a low concentration in the system. A resonant sensor of the present invention has a receiving layer that contains a polymer having a repeating unit represented by Formula (1). In Formula, R.sup.1 represents an alkyl group. A plurality of R.sup.1's may be the same as or different from each other. R.sup.2 represents a hydrogen atom, an alkyl group, or an aryl group. ##STR00001##

Resonant sensor

An object of the present invention is to provide a resonant sensor having excellent sensitivity and selectivity with respect to a component to be detected that is contained at a low concentration in the system. A resonant sensor of the present invention has a receiving layer that contains a polymer having a repeating unit represented by Formula (1). In Formula, R.sup.1 represents an alkyl group. A plurality of R.sup.1's may be the same as or different from each other. R.sup.2 represents a hydrogen atom, an alkyl group, or an aryl group. ##STR00001##

RESIST UNDERLAYER FILM MATERIAL, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM

A resist underlayer film material used in multilayer resist method contains (A) compound shown by following general formula (1), and (B) organic solvent, where X independently represents monovalent organic group shown by following general formula (2); W contains an “m” number of partial structures each independently shown by following formula (3); “m” and “n” each represent an integer of 1 to 10; broken lines represent bonding arms; Z represents aromatic group; A represents single bond or —O—(CH.sub.2).sub.p—; “k” represents integer of 1 to 5; “p” represents integer of 1 to 10; R.sup.01 represents hydrogen atom or monovalent organic group having 1 to 10 carbon atoms. Material is capable of forming resist underlayer film excellent in planarizing property in fine patterning process by multilayer resist method in semiconductor-device manufacturing process; and patterning processes and methods for forming resist underlayer film use material.

##STR00001##

RESIST UNDERLAYER FILM MATERIAL, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM

A resist underlayer film material used in multilayer resist method contains (A) compound shown by following general formula (1), and (B) organic solvent, where X independently represents monovalent organic group shown by following general formula (2); W contains an “m” number of partial structures each independently shown by following formula (3); “m” and “n” each represent an integer of 1 to 10; broken lines represent bonding arms; Z represents aromatic group; A represents single bond or —O—(CH.sub.2).sub.p—; “k” represents integer of 1 to 5; “p” represents integer of 1 to 10; R.sup.01 represents hydrogen atom or monovalent organic group having 1 to 10 carbon atoms. Material is capable of forming resist underlayer film excellent in planarizing property in fine patterning process by multilayer resist method in semiconductor-device manufacturing process; and patterning processes and methods for forming resist underlayer film use material.

##STR00001##

Allyloxy derivative, resist underlayer forming composition using the same, and method of manufacturing resist underlayer and semiconductor device using the same

The present invention provides a resist underlayer forming composition, which is well in heat resistance and gap filling. Further, the present invention provides methods of manufacturing a resist underlayer and semiconductor device using it. [Means for Solution] A composition comprising a allyloxy derivative having a specific group and a solvent, and methods of manufacturing a resist underlayer and semiconductor device using it.