C09D179/00

Protective water reversible clear coating for substrates

A protective, sacrificial, water-reversible, coating composition for the protection of substrates comprised of water, a volatile base, a film-forming acrylic polymer in a water dispersion form, a compatabilizing polymer, specifically poly (2-ethyl-2-oxazoline), a poly acidic polymer (pH specific in terms of its solubility), wherein said coating is both water applied and water reversible or re-soluble under specific pH conditions.

Protective water reversible clear coating for substrates

A protective, sacrificial, water-reversible, coating composition for the protection of substrates comprised of water, a volatile base, a film-forming acrylic polymer in a water dispersion form, a compatabilizing polymer, specifically poly (2-ethyl-2-oxazoline), a poly acidic polymer (pH specific in terms of its solubility), wherein said coating is both water applied and water reversible or re-soluble under specific pH conditions.

Laser-releasable bonding materials for 3-D IC applications

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
20230187257 · 2023-06-15 ·

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

Blends of fluoroalkyl-containing ester oligomers with polycarbodiimide(s)

For imparting enhanced water-repellency and oil-repellency properties to substrates compositions comprising blends of (A) one or more ester oligomers and (B) one or more polycarbodiimides. Also methods for applying such compositions and articles treated with such compositions.

Blends of fluoroalkyl-containing ester oligomers with polycarbodiimide(s)

For imparting enhanced water-repellency and oil-repellency properties to substrates compositions comprising blends of (A) one or more ester oligomers and (B) one or more polycarbodiimides. Also methods for applying such compositions and articles treated with such compositions.

Carbodiimide Curing For Packaging Coating Compositions

Coated packages and methods for coating such packages is disclosed The coating compositions comprise a carboxyl-containing polymer and a polycarbodiimide.

ADHESIVE FILM AND PROCESS FOR PRODUCING THE SAME
20170283667 · 2017-10-05 ·

The present invention provides an adhesive film hardly suffering from fisheyes and deposition of dirt and dusts thereonto and having excellent mechanical strength and heat resistance as well as good adhesion properties, which can be suitably used as various surface protective films, etc. The present invention relates to an adhesive film comprising a polyester film and an adhesive layer formed on at least one surface of the polyester film, in which the adhesive layer comprises a resin having a glass transition point of not higher than 0° C., and an antistatic agent, and a thickness of the adhesive layer is not more than 10 μm.

COMPOSITIONS AND METHODS FOR IMPROVING ADHESION OF AN IMAGE TO A TREATED SUBSTRATE
20210403680 · 2021-12-30 · ·

Compositions and methods that generally relates to treating a substrate and for improving adhesion of an image to a treated substrate and more particularly relates to systems and methods utilizing a combination of a poly tertiary amide, colloidal silica, and optionally a polymeric binder, for treating a substrate and for improving adhesion of an electrographic image to a treated substrate.

COMPOSITIONS AND METHODS FOR IMPROVING ADHESION OF AN IMAGE TO A TREATED SUBSTRATE
20210403680 · 2021-12-30 · ·

Compositions and methods that generally relates to treating a substrate and for improving adhesion of an image to a treated substrate and more particularly relates to systems and methods utilizing a combination of a poly tertiary amide, colloidal silica, and optionally a polymeric binder, for treating a substrate and for improving adhesion of an electrographic image to a treated substrate.