Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

A pressure sensitive adhesive composition includes a polyurethane polymer that includes the reaction product of a polyisocyanate component and a polyol component. The polyol component has a total solubility parameter ranging from 10 to 14 (cal/cm.sup.3).sup.1/2.

A pressure sensitive adhesive composition includes a polyurethane polymer that includes the reaction product of a polyisocyanate component and a polyol component. The polyol component has a total solubility parameter ranging from 10 to 14 (cal/cm.sup.3).sup.1/2.

Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use.

Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

The purpose of the present invention is to provide a double-sided adhesive film which has a generally equal elongation in the XY (longitudinal and transverse) directions, more preferably in the thickness direction, while being prevented from the occurrence of adhesive protrusion or glue burr, and which has higher adhesive force and higher holding power in comparison to similar single-layer adhesive articles, while being applicable to a stretchable or flexible adherend. A double-sided adhesive film according to the present invention is a substrate-less double-sided adhesive film which is composed of a center layer that is formed of a resin adhesive, and adhesive layers that are superposed on the front surface and the back surface of the center layer, said adhesive layers being formed of a resin that is the same as or similar to the resin that constitutes the center layer, wherein the weight average molecular weight or the crosslinking degree of the resin that constitutes the center layer is higher than the weight average molecular weight or the crosslinking degree of the resin that constitutes the adhesive layers. This double-sided adhesive film is characterized in that the tolerance between the elongation in the longitudinal direction and the elongation in the transverse direction is ±20% or less relative to one of the elongations, more preferably, the elongation in the longitudinal direction and the elongation in the transverse direction are equal to each other.

The disclosed latex system comprises a one-component, closed-cell, semi-foam, mastic sealant using gas-filled, flexible, organic microspheres to create a product that is elastic and compressible under pressure without protruding in an outward direction when compressed, thereby allowing the applied sealant to compress in an enclosed, maximum-filled channel unlike typical mastic sealants (while retaining the ability to rebound). This allows the sealant to function as a gasket, and, once fully cured, to have properties including vibration damping, insulating, and condensation resistance. The sealant can be formulated as an air barrier or a vapor barrier and at various degrees of moisture resistance. It may be applied by different packaging variations including aerosol can (bag in can or bag on valve), airless sprayer, cartridge tubes, foil tubes, squeeze tubes, and buckets to be applied using a brush, trowel, spatula, etc. The disclosed mastic sealant can also be formulated to be smoke-resistant and flame-resistant.

The disclosed latex system comprises a one-component, closed-cell, semi-foam, mastic sealant using gas-filled, flexible, organic microspheres to create a product that is elastic and compressible under pressure without protruding in an outward direction when compressed, thereby allowing the applied sealant to compress in an enclosed, maximum-filled channel unlike typical mastic sealants (while retaining the ability to rebound). This allows the sealant to function as a gasket, and, once fully cured, to have properties including vibration damping, insulating, and condensation resistance. The sealant can be formulated as an air barrier or a vapor barrier and at various degrees of moisture resistance. It may be applied by different packaging variations including aerosol can (bag in can or bag on valve), airless sprayer, cartridge tubes, foil tubes, squeeze tubes, and buckets to be applied using a brush, trowel, spatula, etc. The disclosed mastic sealant can also be formulated to be smoke-resistant and flame-resistant.