To provide an adhesive excellent in adhesion to a thermoplastic resin and an ethylene/vinyl alcohol copolymer. An adhesive comprising a hydrolyzate of a resin composition containing a thermoplastic resin (A), a copolymer (B) of ethylene and a vinyl ester and/or an acrylic acid ester having a vinyl ester and/or acrylic acid ester content higher by at least 5 mol % than (A); and a modified product having (A) grafted by (B), and an adhesive resin composition comprising it.

To provide an adhesive excellent in adhesion to a thermoplastic resin and an ethylene/vinyl alcohol copolymer. An adhesive comprising a hydrolyzate of a resin composition containing a thermoplastic resin (A), a copolymer (B) of ethylene and a vinyl ester and/or an acrylic acid ester having a vinyl ester and/or acrylic acid ester content higher by at least 5 mol % than (A); and a modified product having (A) grafted by (B), and an adhesive resin composition comprising it.

To provide an adhesive excellent in adhesion to a thermoplastic resin and an ethylene/vinyl alcohol copolymer.

An adhesive comprising a hydrolyzate of a resin composition containing a thermoplastic resin (A), a copolymer (B) of ethylene and a vinyl ester and/or an acrylic acid ester having a vinyl ester and/or acrylic acid ester content higher by at least 5 mol % than (A); and a modified product having (A) grafted by (B), and an adhesive resin composition comprising it.

Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200 C., especially above 300 C., yet easy to debond afterwards to allow separation of the top and bottom substrates.

The subject matter is a new curable composition comprising at least one hydroxyl-group containing resin, at least one nitroso-containing compound or at least one nitroso precursor compound, at least one hydrophopic silica and at least one blocked isocyanate, which provides excellent adhesion and steam resistance for rubber to substrate bonds, a process for bonding two substrates with this new curable composition and the corresponding article.

Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200 C., especially above 300 C., yet easy to debond afterwards to allow separation of the top and bottom substrates.