The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer having no functional group which reacts with the moisture-curable component, and a water content of the base polymer after storage at 25° C. and 50% RH for 24 hours is 0.1% by weight or less, and wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer having no functional group which reacts with the moisture-curable component, and a water content of the base polymer after storage at 25° C. and 50% RH for 24 hours is 0.1% by weight or less, and wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

Provided is a curable composition having excellent workability and being capable of forming a cured product having super heat resistance by curing. The curable composition of the present disclosure includes a curable compound represented by Formula (1) below and a radical polymerization initiator. In the following formula, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. Ar.sup.1 to A.sup.3 each represent an arylene group or a group in which two or more arylene groups are bonded via a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

##STR00001##

Provided is a curable composition having excellent workability and being capable of forming a cured product having super heat resistance by curing. The curable composition of the present disclosure includes a curable compound represented by Formula (1) below and a radical polymerization initiator. In the following formula, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. Ar.sup.1 to A.sup.3 each represent an arylene group or a group in which two or more arylene groups are bonded via a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

##STR00001##

The present disclosure relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing an Ag sintering paste in the form of a film. The present disclosure can reduce the process time by minimizing a sintering process, and can reduce equipment investment cost.

Chemically anchoring long-chain polymer networks of tough hydrogels on solid surfaces can represent a general strategy to design tough and functional bonding between hydrogels and solid materials, achieving interfacial toughness over 1000 Jm.sup.−2.

Chemically anchoring long-chain polymer networks of tough hydrogels on solid surfaces can represent a general strategy to design tough and functional bonding between hydrogels and solid materials, achieving interfacial toughness over 1000 Jm.sup.−2.

The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

A green, safe and environmentally-friendly process and production equipment for industrialized continuous large-scale production of a formaldehyde-free water-based adhesive; the process includes: performing a polymerization reaction on a monomer having a carbon-carbon unsaturated double bond and an acid anhydride group and at least one other monomer containing a carbon-carbon unsaturated double bond that serve as raw materials in the presence of a solvent and an initiator; and performing solid-liquid separation on the polymerization reaction solution under the action of a high-temperature inert carrier gas, vaporizing, condensing, and recovering the solvent for indiscriminate use in polymerization reaction, and performing a gas-solid reaction on the solid material serving as a polymer intermediate and a mixed gas of ammonia gas and air to obtain a solid formaldehyde-free water-based adhesive product.