Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

This invention relates to an adhesive composition for a tire cord, a tire cord including an adhesive layer formed from the adhesive composition, and a tire including the tire cord. According to the present disclosure, an environment-friendly adhesive composition for a tire cord that can not only improve adhesive strength between tire rubber and a tire cord, but can also improve strength of a tire cord is provided.

This invention relates to an adhesive composition for a tire cord, a tire cord including an adhesive layer formed from the adhesive composition, and a tire including the tire cord. According to the present disclosure, an environment-friendly adhesive composition for a tire cord that can not only improve adhesive strength between tire rubber and a tire cord, but can also improve strength of a tire cord is provided.

An adhesive composition made from an elastomer and a tackifying resin. The tackifying resin includes a farnesene polymer or copolymer having the following properties: i) less than 10 weight percent of volatile organic compounds; ii) Mn between 300 Da and 1000 Da; iii) Mw between 400 Da and 3000 Da; iv) Mw/Mn between 1.00 and 3.00; v) Tg between −50° C. and 20° C.; and vi) viscosity between 400,000 cP and 1,000,000 cP at 25° C. A method of making the farnesene-based polymer or copolymer includes combining a farnesene monomer and a solvent and optionally adding one or more co-monomers selected from dienes, branched mono-olefins, and vinyl aromatics, to provide a monomer feed, and polymerizing the monomer feed by combining it with a Friedel-Crafts initiator in a vessel. The farnesene-based polymer or copolymer tackifier may be combined with one or more elastomers and one or more other tackifiers to form an adhesive composition.

An adhesive composition made from an elastomer and a tackifying resin. The tackifying resin includes a farnesene polymer or copolymer having the following properties: i) less than 10 weight percent of volatile organic compounds; ii) Mn between 300 Da and 1000 Da; iii) Mw between 400 Da and 3000 Da; iv) Mw/Mn between 1.00 and 3.00; v) Tg between −50° C. and 20° C.; and vi) viscosity between 400,000 cP and 1,000,000 cP at 25° C. A method of making the farnesene-based polymer or copolymer includes combining a farnesene monomer and a solvent and optionally adding one or more co-monomers selected from dienes, branched mono-olefins, and vinyl aromatics, to provide a monomer feed, and polymerizing the monomer feed by combining it with a Friedel-Crafts initiator in a vessel. The farnesene-based polymer or copolymer tackifier may be combined with one or more elastomers and one or more other tackifiers to form an adhesive composition.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

Water-based adhesive compositions are improved by the incorporation of hollow polymeric microspheres having outer surfaces coated with one or more barrier materials such as calcium carbonate particles. The adhesive compositions exhibit enhanced rheology, sprayability, drying time, tack and storage stability as compared to analogous adhesives that are not modified with coated hollow polymeric microspheres. Such compositions are useful as both contact adhesives as well as wet bonding one-way adhesives.

Water-based adhesive compositions are improved by the incorporation of hollow polymeric microspheres having outer surfaces coated with one or more barrier materials such as calcium carbonate particles. The adhesive compositions exhibit enhanced rheology, sprayability, drying time, tack and storage stability as compared to analogous adhesives that are not modified with coated hollow polymeric microspheres. Such compositions are useful as both contact adhesives as well as wet bonding one-way adhesives.