A hybrid system for use as an adhesive, coating or paint, wherein the hybrid system includes a) a reaction resin based on α,β-unsaturated compounds, b) a reaction resin based on compounds that include CH-acidic methylene groups, and c) a primary amine, and to related subject matter.

A composition is described comprising a cyclic olefin; a ring opening metathesis polymerization catalyst; and at least 40 wt. % of thermally conductive particles. The thermally conductive particles are selected such that the composition after curing has a thermal conductivity of at least 1W/M*K. In one embodiment, the thermally conductive particle comprises a combination of smaller and larger thermally conductive particles. In another embodiment, the thermally conductive particles comprise boron nitride particles. Also described are (e.g. structural) adhesives, methods of bonding and articles.

Adhesive composition and articles are described comprising a carrier substrate (e.g. release liner or backing) and an adhesive composition disposed on the carrier substrate. The adhesive composition comprises at least 20 wt.% of a polymer; unpolymerized cyclic olefin; and a (e.g. latent) ring opening metathesis polymerization catalyst or precatalyst thereof. The polymer may have a Tg less than 25° C. and/or may be an acrylic polymer. Also described is a method of bonding.

A molecular adhesive system for reversibly joining two surfaces, comprising: an anionic coating on a first of two surfaces to be joined; a conductive polymer nanotube array on a second of the two surfaces to be joined; wherein said conductive polymer nanotube array is functionalized with metal nanoparticles; and an electric potential applied across said two surfaces.

A molecular adhesive system for reversibly joining two surfaces, comprising: an anionic coating on a first of two surfaces to be joined; a conductive polymer nanotube array on a second of the two surfaces to be joined; wherein said conductive polymer nanotube array is functionalized with metal nanoparticles; and an electric potential applied across said two surfaces.

Use of a synthetic resin system as an adhesive for chemical fixing technology, especially for fixing anchoring means in drilled holes, which synthetic resin system includes a) a reaction resin based on α, β-unsaturated compounds, b) a reaction resin based on compounds that include CH-acidic methylene groups, and c) a catalyst, and to related subject matter.

Use of a synthetic resin system as an adhesive for chemical fixing technology, especially for fixing anchoring means in drilled holes, which synthetic resin system includes a) a reaction resin based on α, β-unsaturated compounds, b) a reaction resin based on compounds that include CH-acidic methylene groups, and c) a catalyst, and to related subject matter.

A crosslinkable composition containing: a liquid monocyclic olefin ring-opened polymer (A) having a reactive group at a polymer chain end thereof and a weight-average molecular weight (Mw) of 1,000 to 50,000; and a crosslinkable compound (B) having, in the molecule, two or more functional groups reactive with the reactive group at the polymer chain end of the monocyclic olefin ring-opened polymer (A).

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain multifunctional crosslinking agents, and two or more phenolic compounds which are resistant to thermo-oxidative chain degradation and exhibit improved mechanical properties.

An adhesive composition is described comprising unpolymerized cyclic olefin, a ring opening metathesis polymerization (ROMP) catalyst or precatalyst thereof, and one or more adhesion promoter polymers. In one embodiment, the adhesion promoter is a polyolefin comprising maleic anhydride or silicon-containing moieties. In one embodiment, a combination of at least one polymeric polyisocyanate and at least one polyolefin comprising maleic anhydride or silicon-containing moieties provides a synergistic improvement. In another embodiment, a polymeric polyisocyanate adhesion promoter comprising oxygen atoms in the backbone has been found useful for bonding substrates such as polyamide, polyether ether ketone, or polyether imide. Also described are methods of bonding a substrate and articles, such as an electric battery cold plate assembly.