The present invention relates to a moisture-crosslinkable composition comprising: at least one polymer (A) comprising at least one alkoxysilane group; at least 25% by weight of at least one carbonate filler (B) relative to the total weight of said composition; at least one compound chosen from bis(alkoxysilane)s or tri(alkoxysilane)s (C) having a molar mass ranging from 250 to 1000 g/mol; at least one crosslinking catalyst (D);
said composition being characterized in that it comprises a plasticizer content of less than or equal to 1% by weight relative to the total weight of the composition.

A multilayer film bonded to a base fabric includes a first layer bonded to the base fabric; and a second layer disposed on the first layer. The first layer, the second layer, or both includes a thermoplastic elastomer. The thermoplastic elastomer is at least one selected from the group consisting of a polyester-based elastomer, a polyurethane-based elastomer, and a polyamide-based elastomer. A melt strength of the multilayer film is greater than or equal to 7.5 mN.

A multilayer film bonded to a base fabric includes a first layer bonded to the base fabric; and a second layer disposed on the first layer. The first layer, the second layer, or both includes a thermoplastic elastomer. The thermoplastic elastomer is at least one selected from the group consisting of a polyester-based elastomer, a polyurethane-based elastomer, and a polyamide-based elastomer. A melt strength of the multilayer film is greater than or equal to 7.5 mN.

A curable perfluoropolyether adhesive composition containing: (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by -C.sub.aF.sub.2aO- in a main chain; (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; (D) 0.05 to 5 parts by mass of an organosilicon compound, other than the component (B), having per molecule any two or more selected from a silicon-bonded hydrogen atom, an epoxy group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom, and a trialkoxysilyl group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom.

A curable perfluoropolyether adhesive composition containing: (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by -C.sub.aF.sub.2aO- in a main chain; (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; (D) 0.05 to 5 parts by mass of an organosilicon compound, other than the component (B), having per molecule any two or more selected from a silicon-bonded hydrogen atom, an epoxy group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom, and a trialkoxysilyl group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom.

A curable perfluoropolyether adhesive composition containing: (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by -C.sub.aF.sub.2aO- in a main chain; (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; (D) 0.05 to 5 parts by mass of an organosilicon compound, other than the component (B), having per molecule any two or more selected from a silicon-bonded hydrogen atom, an epoxy group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom, and a trialkoxysilyl group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom.

A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer metal junction are also described.

A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer metal junction are also described.

A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer metal junction are also described.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.