Patent classifications
C09J173/00
Reactivity-introduced compound, manufacturing method thereof, surface-reactive solid using same and manufacturing method of surface-reactive solid
There are provided a reactivity-introduced compound that imparts reactivity capable of bonding of a solid to another material, can perform imparting to a solid with high efficiency, and has high adhesion of bonding, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid. There are provided a reactivity-introduced compound provided on a surface of the solid for bonding the solid to another material, the reactivity-introduced compound including a triazine ring, an alkoxysilyl group (including a case where an alkoxy group in the alkoxysilyl group is OH), and a diazomethyl group in one molecule, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid.
Reactivity-introduced compound, manufacturing method thereof, surface-reactive solid using same and manufacturing method of surface-reactive solid
There are provided a reactivity-introduced compound that imparts reactivity capable of bonding of a solid to another material, can perform imparting to a solid with high efficiency, and has high adhesion of bonding, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid. There are provided a reactivity-introduced compound provided on a surface of the solid for bonding the solid to another material, the reactivity-introduced compound including a triazine ring, an alkoxysilyl group (including a case where an alkoxy group in the alkoxysilyl group is OH), and a diazomethyl group in one molecule, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid.
Moisture-curable hot melt adhesive
The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa.Math.s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.
Moisture-curable hot melt adhesive
The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa.Math.s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.
REACTIVITY-INTRODUCED COMPOUND, MANUFACTURING METHOD THEREOF, SURFACE-REACTIVE SOLID USING SAME AND MANUFACTURING METHOD OF SURFACE-REACTIVE SOLID
There are provided a reactivity-introduced compound that imparts reactivity capable of bonding of a solid to another material, can perform imparting to a solid with high efficiency, and has high adhesion of bonding, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid.
There are provided a reactivity-introduced compound provided on a surface of the solid for bonding the solid to another material, the reactivity-introduced compound including a triazine ring, an alkoxysilyl group (including a case where an alkoxy group in the alkoxysilyl group is OH), and a diazomethyl group in one molecule, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid.
Compositions Comprising Ethylene-Carbon Monoxide Copolymers
The invention provides a composition comprising an ethylene-based polymer and wherein the ethylene-based polymer has the following properties: (A) a CO content from greater than 0 to less than 10 weight percent CO (carbon monoxide), based on the weight of the polymer, and (B) a melt index (I2) from 0.1 to less than 3 g/10 min; and (C) a density from 0.923 to 0.928 g/cc; and wherein the ethylene-based polymer has a melting point, Tm, in C., that meets the following relationship: Tm ( C.)<601.4*(Density N in g/cc)447.8 C.
Moisture-Curable Hot Melt Adhesive
The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa.Math.s or less at a temperature of 170 C. and (C) a polyester-polyether copolymer.