A binder has at least one isocyanate and at least one biopolymer mixed with water. The biopolymer may be a biopolymer nanoparticle or cooked and chemically modified starch. Optionally, the binder may also include urea. The biopolymer and water are mixed, and the isocyanate is added to the mixture. The binder may have a viscosity that is suitable for being sprayed on a substrate to make a composite material, for example a viscosity of 700 cP or less or 500 cP or less at 40° C. The substrate may be wood, another lignocellulosic material, or synthetic or natural fibers. In particular examples, the binder is used to make no added formaldehyde wood composites including particle board and fiberboard. Alternatively, the binder may have a higher viscosity and be used to make plywood.

The present disclosure provides a two-part composition polymeric material including a first part and a second part. The first part includes an inorganic filler and a polymeric material including a polymerized reaction product of a polymerizable composition including components. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; and an optional second hydroxyl-containing compound having a single OH group. The second part includes a polythiol having an average sulfhydryl group functionality of 2 or greater. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymerized product of the two-part composition and a battery module. Advantageously, two-part compositions can be used as coatings and adhesive systems including high loadings of inorganic filler, such as thermally conductive filler, with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

The present disclosure provides a two-part composition polymeric material including a first part and a second part. The first part includes an inorganic filler and a polymeric material including a polymerized reaction product of a polymerizable composition including components. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; and an optional second hydroxyl-containing compound having a single OH group. The second part includes a polythiol having an average sulfhydryl group functionality of 2 or greater. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymerized product of the two-part composition and a battery module. Advantageously, two-part compositions can be used as coatings and adhesive systems including high loadings of inorganic filler, such as thermally conductive filler, with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

An adhesive composition comprising a polyurethane and a cationic polymeric dopant or a polymerizable cationic dopant may be used to form one or more adhesive layers of electro-optic assemblies. They enable improved electro-optic performance of the corresponding; electro-optic devices even at low temperatures.

An adhesive composition comprising a polyurethane and a cationic polymeric dopant or a polymerizable cationic dopant may be used to form one or more adhesive layers of electro-optic assemblies. They enable improved electro-optic performance of the corresponding; electro-optic devices even at low temperatures.

A fiber body forming method includes a step of applying, to a fiber body containing fibers, a liquid containing a thermoplastic resin which binds the fibers; and a step of heating the fiber body to which the liquid is applied, and in this method, the thermoplastic resin has a glass transition temperature of 10° C. or less, and the thermoplastic resin in the liquid has an average particle diameter of 30 nm or less.

The present invention relates to an aqueous, solids-containing dipping bath composition for treating reinforcing inserts for rubber products comprising the following components or consisting of these components, (A) at least one blocked MDI mixture, the MDI mixture comprising MDI oligomers of formula (I), n being a whole number from 1 to 8, and MDI monomers; (B) at least one latex; (C) at least one compound selected from the group consisting of polyacrylates, lignin derivatives and mixtures hereof; and (D) possibly at least one additive; the dipping bath composition being essentially free of epoxides, and the dipping bath composition being essentially free of resorcinol, formaldehyde and the reaction products thereof. ##STR00001##

The present invention relates to an aqueous, solids-containing dipping bath composition for treating reinforcing inserts for rubber products comprising the following components or consisting of these components, (A) at least one blocked MDI mixture, the MDI mixture comprising MDI oligomers of formula (I), n being a whole number from 1 to 8, and MDI monomers; (B) at least one latex; (C) at least one compound selected from the group consisting of polyacrylates, lignin derivatives and mixtures hereof; and (D) possibly at least one additive; the dipping bath composition being essentially free of epoxides, and the dipping bath composition being essentially free of resorcinol, formaldehyde and the reaction products thereof. ##STR00001##

Engineered wood products and binder compositions are provided. In preferred embodiments, the engineered wood products include wax. Methods are also provided for formulating binders for wood comprising unmodified soy flour and synthetic adhesives. The soy-based formulations are prepared by mixing unmodified soy flour with the synthetic adhesive prior to application to the wood or by adding them sequentially to the wood. The present invention provides adequate bonding at reduced cost.

A process prepares a prepolymer containing a urethane group and a curable silicon-functional group, or a prepolymer of formula (IV),

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The prepolymer may be cured to a cross-linked polymer by ambient moisture and is therefore suitable for use as a component in a one-component sealant or adhesive composition.