Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

A polythioether prepolymer including functional groups capable of being obtained by the reaction: of at least one compound T having a number f of thiol functional group number selected from 2, 3, 4 and 6, with at least one compound E having a number g of epoxy functional groups number selected from 2 and 3. Also, a method of preparation for this prepolymer, a composition including this prepolymer and an oligomer as well as its use as a mastic and a polythioether polymer obtained from this polythioether prepolymer with an oligomer.

Disclosed herein are methods and apparatuses for curing a polymerizable material capable of cure through a redox reaction by electrically contacting the polymerizable material with an anode and a cathode to create a voltage bias that promotes curing of the polymerizable material.

A material for forming an adhesive film used for an adhesive film formed directly under a resist upper layer film, contains: (A) a resin having at least one structural unit containing a fluorine-substituted organic sulfonyl anion structure and having at least one structural unit shown by the following general formula (2) besides the structural unit containing the fluorine-substituted organic sulfonyl anion structure; (B) a thermal acid generator; and (C) an organic solvent. The material forms an adhesive film in a fine patterning process by a multilayer resist method in a semiconductor device manufacturing process, where the material gives an adhesive film that has high adhesiveness to a resist upper layer film, has an effect of suppressing fine pattern collapse, and also makes it possible to form an excellent pattern profile. A patterning process uses the material. A method forms the adhesive film.

##STR00001##

A material for forming an adhesive film used for an adhesive film formed directly under a resist upper layer film, contains: (A) a resin having at least one structural unit containing a fluorine-substituted organic sulfonyl anion structure and having at least one structural unit shown by the following general formula (2) besides the structural unit containing the fluorine-substituted organic sulfonyl anion structure; (B) a thermal acid generator; and (C) an organic solvent. The material forms an adhesive film in a fine patterning process by a multilayer resist method in a semiconductor device manufacturing process, where the material gives an adhesive film that has high adhesiveness to a resist upper layer film, has an effect of suppressing fine pattern collapse, and also makes it possible to form an excellent pattern profile. A patterning process uses the material. A method forms the adhesive film.

##STR00001##

Various examples are directed to a glucose sensor comprising a working electrode to support an oxidation reaction and a reference electrode to support a redox reaction. The reference electrode may comprise silver and silver chloride. The Glucose sensor may also comprise an anti-mineralization agent positioned at the reference electrode to reduce formation of calcium carbonate at the reference electrode.

A preparation method of a polyphenylene sulfide resin, and a polyphenylene sulfide resin prepared by the method using a sulfur-containing compound, an alkaline substance and p-dichlorobenzene as raw materials, a fatty acid as a polycondensation aid to carry out a polycondensation reaction. After purification treatment, a primary polyphenylene sulfide is obtained, which then reacts with a terminal-group adjusting agent at a high temperature to generate the polyphenylene sulfide resin resulting in high yield and low cost. The prepared polyphenylene sulfide resin has high reactivity, high melting crystallization temperature and excellent thermal stability. The resulting polyphenylene sulfide resin can be directly used for extrusion and injection molding.

The present invention provides a polyarylene sulfide resin composition comprising a mixture of polyarylene sulfide and a binder resin having excellent electrical conductivity and high temperature stability.

Two-part cyanoacrylate/free radical curable adhesive systems, are provided.

Two-part cyanoacrylate/free radical curable adhesive systems, are provided.