There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur.

A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur.

A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

A reel body is the reel body in which an adhesive film having an adhesive layer on a base material layer is wound around a winding core. The adhesive film does not have a protective layer on the adhesive layer and is wound around the winding core in a state in which the adhesive layer and the base material layer are contiguous to each other in the radial direction of the winding core. A width of the winding core in an axial direction is smaller than a width of the adhesive film. In a rolled body of the adhesive film, an overhang portion jutting out in the axial direction of the winding core is provided.

A method for producing a multilayer member having a first member containing a crystallizable thermoplastic resin, an adhesion layer, and a second member includes performing a dry treatment on a surface of the first member containing a crystallizable thermoplastic resin so as to satisfy conditions A and B, applying an adhesive to the surface of the first member to form an adhesive layer on the surface, and adhering the second member to the adhesive layer. (A) The ultimate temperature of the first member is lower than the peak temperature of endothermic peak obtained by DSC of the crystallizable thermoplastic resin. (B) The high temperature holding time of the first member is less than 3.0 seconds, which is when the first member is continuously held at a temperature not lower than a temperature at the starting point of the endothermic peak obtained by DSC of the crystallizable thermoplastic resin.

A method for producing a multilayer member having a first member containing a crystallizable thermoplastic resin, an adhesion layer, and a second member includes performing a dry treatment on a surface of the first member containing a crystallizable thermoplastic resin so as to satisfy conditions A and B, applying an adhesive to the surface of the first member to form an adhesive layer on the surface, and adhering the second member to the adhesive layer. (A) The ultimate temperature of the first member is lower than the peak temperature of endothermic peak obtained by DSC of the crystallizable thermoplastic resin. (B) The high temperature holding time of the first member is less than 3.0 seconds, which is when the first member is continuously held at a temperature not lower than a temperature at the starting point of the endothermic peak obtained by DSC of the crystallizable thermoplastic resin.

Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

A method of producing a connected body, containing: disposing an adhesive film between a first electronic member having a first electronic electrode and a second electronic member having a second electrode; and pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode; wherein the first electronic member has an indented surface, the first electrode is provided in a depressed portion of the indented surface, the second electrode has a substantially flat surface having an area larger than an area of the first electrode, the adhesive film contains: first conductive particles that are dendritic conductive particles; and second conductive particles containing a non-conductive core and a conductive layer provided on the core, and the second conductive particles have an average particle diameter of not less than a depth of the depressed portion.

This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.