A PSA composition comprising a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, a tackifier resin, and a softening agent is provided. The tackifier resin comprises a natural product-based tackifier resin (A) having a softening point higher than 80° C. and containing no aromatic ring, and a petroleum-based tackifier resin (B) having a softening point higher than 100° C. and containing an aromatic ring. The content of the tackifier resin (A) is 40 to 120 parts by weight, the content of the tackifier resin (B) is 5 to 40 parts by weight, the total amount of the tackifier resin is 60 to 160 parts by weight, and the content of the softening agent is 5 to 40 parts by weight with respect to 100 parts by weight of the block copolymer, with respect to 100 parts by weight of the block copolymer.

A block copolymer consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20° C. or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20° C., and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20° C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof.

A block copolymer consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20° C. or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20° C., and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20° C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof.

A blend suitable for use in a release layer of a multilayer protective film. The blends comprise greater than 50 wt. % of an ethylene/alpha-olefin copolymer, a functionalized ethylene-based polymer, and an inorganic filler.

Provided are a multilayer film, a method for producing the multilayer film, and a method for producing a molded body. The multilayer film has excellent three-dimensional overlaying formability and adhesiveness after being formed; can easily be used when being bonded to an adherend; maintains adhesive strength. Specifically, the multilayer film has: an adhesive layer comprising a thermoplastic polymer composition containing a thermoplastic elastomer (A) which is a block copolymer or a hydrogenated product thereof having a polymer block (a1) containing aromatic vinyl compound units and having a polymer block (a2) containing conjugated diene compound units; and a base layer comprising an amorphous resin which has a modulus of elasticity of 2 to 600 MPa at an arbitrary temperature of 110 to 160° C. The tensile elongation at break of the multilayer film at a temperature 5° C. lower than the glass transition temperature of the amorphous resin is at least 160%.

The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range.

The invention features a hot melt adhesive composition including from 5% by weight to 50% by weight of a styrene block copolymer, from 15% by weight to 75% by weight of a bio-based tackifying agent, and from 5% by weight to 40% by weight of an aliphatic plasticizer having a cyclo-aliphatic content of no greater than 1% by weight as tested by .sup.1H-NMR Spectroscopy, wherein said hot melt adhesive composition has an environmentally conscious component content of at least 50% by weight.

The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer having no functional group which reacts with the moisture-curable component, and a water content of the base polymer after storage at 25° C. and 50% RH for 24 hours is 0.1% by weight or less, and wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

Disclosed herein is a method of making polymerizable bio-based monomers containing one phenolic hydroxyl group which has been derivatized to provide at least one polymerizable functional group which is an ethylenically unsaturated functional group (such as a [meth]acrylate group), where the precursors of the polymerizable bio-based monomers are derived from raw lignin-containing biomass. Also disclosed herein are bio-based copolymers prepared from such bio-based monomers and a co-monomer, and methods of making and using such bio-based copolymers. In particular, the bio-based copolymers can be used as pressure sensitive adhesives, binders, and polymer electrolytes.

The present invention relates to a foamed pressure-sensitive adhesive compound on the basis of aromatic polyvinyl-polydiene block copolymers, in particular for double-sided self-adhesive strips, containing a) 39.8 wt. % to 51.8 wt. % of an elastomer component, b) 35.0 wt. % to 58.0 wt % of an adhesive resin component, c) 2.0 wt. % to 15.0 wt. % of a plasticizer component, d) 0.0 wt. % to 18.0 wt. % of further additives and e) microballoons, the microballoons being at least partly expanded.