An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

The present invention relates to a method of producing a glued wood product for use in construction, comprising the steps of: providing at least two wooden pieces each piece comprising at least one joining face; creating a groove in at least one of said joining faces where the groove is arranged between a pair of peripheral edges; applying adhesive onto at least one of the joining faces of at least a first of said two wooden pieces; arranging said first wooden piece so that the joining face which comprises the applied adhesive meets a corresponding joining face of said second wooden piece, wherein at least one of said two joining faces comprises said groove; pressing the two joining faces towards each other so that the adhesive is compressed between said two wooden pieces, and maintaining said pressing for a sufficient time to bond the wooden pieces to each other; wherein the applied pressing force is strong enough to force the wood tissue to collapse at a contact area until the pressure force is transmitted primarily through the adhesive, wherein said contact area is defined by the surface area whereat the two joining faces of said wooden pieces contact each other upon being pressed together.

The present invention has been made in an effort to provide an adhesive coating composition capable of adhering (fastening) a non-oriented electrical steel sheet without using a conventional fastening method such as welding, clamping, or interlocking, a non-oriented electrical steel sheet stack to which the same is applied, and a manufacturing method thereof. According to an exemplary embodiment of the present invention, an adhesive coating composition includes: 40 to 99 wt % of a first component containing a water-soluble resin; and 1 to 60 wt % of a second component containing a composite metal phosphate.

A composite comprises: at least one reinforcing element (10), an adhesive layer (14) made from an adhesive composition and coating the reinforcing element (10), an elastomeric bonding layer (16) made from an elastomeric bonding composition and directly coating the adhesive layer (14), and an elastomeric body made from an elastomeric matrix and embedded in which is the reinforcing element (10) coated with the adhesive layer (14) and with the elastomeric bonding layer (16). The adhesive composition comprises a phenol-aldehyde resin based: on an aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted; and on an aromatic aldehyde bearing an aldehyde function, comprising at least one aromatic ring.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

An adhesive strain sensing pod includes at least one strain sensor, electronics for electrically sensing at least one strain signal from the at least one strain sensor, and a sensor adhesive for adhering the strain sensor to a surface of a structural element. The pod may have a protective case for protecting the strain sensor and the electronics and for transferring at least part of a force, pressing the pod against the surface, to press the strain sensor against the surface. The sensor adhesive may be a liquid adhesive contained in a fragile pouch that ruptures when the pod is forced against the surface, or may be a thermally activated adhesive film that is activated to bond the strain sensor to the surface. A protective film may protect the sensor adhesive prior to installation of the pod and is removed prior to installation of the pod on the surface.

The present invention aims to provide an adhesive sheet excellent in both shear strength and slurry resistance at high temperature and excellent in removability that enables removal without adhesive residue. The present invention also aims to provide a polishing pad with an adhesive sheet including the adhesive sheet. Provided is an adhesive sheet including at least one adhesive layer, the adhesive layer containing a base polymer, a tackifier resin (T1) having a hydroxy value of less than 20 mgKOH/g, and a tackifier resin (T2) having a hydroxy value of 20 mgKOH/g or more and 120 mgKOH/g or less, the base polymer being a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, and the adhesive layer containing the tackifier resin (T1) in an amount of 10 parts by weight or more and 60 parts by weight or less relative to 100 parts by weight of the base polymer, and the tackifier resin (T2) in an amount of 1 part by weight or more and 40 parts by weight or less relative to 100 parts by weight of the base polymer.

A method for manufacturing a semiconductor device according to an aspect of the present disclosure includes a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition having a melt viscosity of 3100 Pa.Math.s or higher at 120° C., a tacky adhesive layer, and a base material film; a step of sticking a surface on the adhesive layer side of the dicing/die-bonding integrated film and a semiconductor wafer together; a step of dicing the semiconductor wafer; a step of expanding the base material film and thereby obtaining adhesive-attached semiconductor elements; a step of picking up the adhesive-attached semiconductor element from the tacky adhesive layer; a step of laminating this semiconductor element to another semiconductor element, with the adhesive interposed therebetween; and a step of heat-curing the adhesive.

An adhesive film including a first adhesive layer, wherein the first adhesive layer contains a first adhesive component and a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles that are dendritic conductive particles, and second conductive particles that are conductive particles other than the first conductive particles, each conductive particle containing a non-conductive core and a conductive layer provided on the core, and a part of the plurality of conductive particles is disposed to protrude from one surface of the first adhesive layer.