The present invention provides a UV-curable pressure-sensitive adhesive composition, comprising: 81 to 97.5 parts of (meth)acrylate polymer having a carboxyl functional group by weight, the amount of the carboxyl functional group in the (meth)acrylate polymer having the carboxyl functional group being equal to or greater than 40 mmol/100 g; 2.5 to 19 parts of an epoxy resin by weight; 0.3 to 6 parts of a polyol by weight; and 0.05 to 5 parts of a photoinitiator by weight. The UV-curable pressure-sensitive adhesive composition has good anti-repulsion. The present invention further provides a UV-curable adhesive tape comprising the UV-curable pressure-sensitive adhesive composition.

The disclosure generally relates to networking infrastructure and, more particularly, to installing transient infrastructure for ubiquitous networking applications. A wireless gateway device is sent to physical premises with a parcel. After the wireless gateway device is delivered to the physical premises, a processor of the wireless gateway device draws power from the energy source to perform operations comprising executing program code stored in non-transitory processor-readable medium to establish a wireless communications connection with a network service through a first type of wireless communications interface. The wireless gateway device performs operations comprising establishing wireless communications with one or more wireless peripheral devices in the physical premises through the second type of wireless communications interface.

The present disclosure relates to a B-stageable epoxy adhesive composition and an article manufactured therefrom. The B-stageable epoxy adhesive composition comprises (A) 20% to 50% by weight of a first epoxy resin with an epoxide equivalent of 5000 g/eq or more; (B) 5% to 20% by weight of a second epoxy resin with an epoxide equivalent of 800 g/eq or less and having 2 to 4 epoxy functional groups; (C) 5% to 30% by weight of a carboxyl terminated polyester; (D) 5% to 15% by weight of a poly-isocyanate modified polyester; and (E) 0.1% to 0.5% by weight of a crosslinking agent containing 2 or more aziridine groups, all the content percentages are based on the total weight of the B-stageable epoxy adhesive composition. The B-stageable epoxy adhesive composition and the related products could be widely used as insulation protection for battery management, bus bar, transformers and other markets with a good balance between a high bonding strength and a high temperature resistance, and others.

An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

[Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force.

[Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B).

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

A low-cost, multi-function adhesive wireless communications and transducer platform with a form factor that unobtrusively integrates one or more transducers and one or more wireless communication devices in an adhesive product system. In an aspect, the adhesive product system integrates transducer and wireless communication components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the constituent components but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including sensing, notification, security, and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.

Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.