Adhesive composition and articles are described comprising a carrier substrate (e.g. release liner or backing) and an adhesive composition disposed on the carrier substrate. The adhesive composition comprises at least 20 wt.% of a polymer; unpolymerized cyclic olefin; and a (e.g. latent) ring opening metathesis polymerization catalyst or precatalyst thereof. The polymer may have a Tg less than 25° C. and/or may be an acrylic polymer. Also described is a method of bonding.

Adhesive composition and articles are described comprising a carrier substrate (e.g. release liner or backing) and an adhesive composition disposed on the carrier substrate. The adhesive composition comprises at least 20 wt.% of a polymer; unpolymerized cyclic olefin; and a (e.g. latent) ring opening metathesis polymerization catalyst or precatalyst thereof. The polymer may have a Tg less than 25° C. and/or may be an acrylic polymer. Also described is a method of bonding.

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III):

##STR00001##

A conductive adhesive and a bonding method of circuit board are provided. The conductive adhesive includes a substrate and an insulating region formed on a surface of the substrate and a conductive region. The insulating region includes a plurality of insulating retaining walls arranged along a same direction and in intervals. The conductive region includes a plurality of conductive adhesive bodies and the conductive adhesive bodies are filled in gaps between the adjacent insulating retaining walls.

An adhesive composition having a low dielectric constant and dielectric loss tangent and an excellent folding endurance includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent.

An adhesive composition having a low dielectric constant and dielectric loss tangent and an excellent folding endurance includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent.

An adhesive sheet capable of bonding adhesive layers together at normal temperatures, with little stickiness of the adhesive layers due to a plasticizer seeping out from a substrate providing a protective material using the adhesive sheet and a wire harness. An adhesive sheet including: a substrate containing 20-100 parts by mass of a polyester-based plasticizer to 100 parts by mass of a vinyl halide-based resin; a primer layer; adhesive layers included amount of a tackifier is 0-250 parts by mass and the inorganic microparticles is 0-250 parts by mass to 100 parts by mass of an elastomer, and a total value of the included amounts of the tackifier and the inorganic microparticles is 0-350 parts by mass; wherein the adhesive layers probe tack of 7 N/cm2 or less with ASTM D 2979, and the adhesive force between the adhesive layers width of 15 mm is 1.5 N or more.

To provide an adhesive sheet, the sheet increasing manufacturing efficiency of products including an adhesive agent layer, while using the adhesive agent layer to which an electro-conductive organic polymer compound is added. An adhesive sheet for use in applying a wiring board to a surface onto which the wiring board is to be applied, the adhesive sheet is constituted by an adhesive agent layer including an electro-conductive organic polymer compound and an adhesive material; a first releasing sheet provided on front surface of the adhesive agent layer; and a second releasing sheet provided on a back surface corresponding to a back surface of the front surface in the adhesive agent layer.

To provide an adhesive sheet, the sheet increasing manufacturing efficiency of products including an adhesive agent layer, while using the adhesive agent layer to which an electro-conductive organic polymer compound is added. An adhesive sheet for use in applying a wiring board to a surface onto which the wiring board is to be applied, the adhesive sheet is constituted by an adhesive agent layer including an electro-conductive organic polymer compound and an adhesive material; a first releasing sheet provided on front surface of the adhesive agent layer; and a second releasing sheet provided on a back surface corresponding to a back surface of the front surface in the adhesive agent layer.

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III): ##STR00001## ##STR00002##