The invention provides a composition for forming an easy-to-detach thin resin film, the composition being characterized by including a urethane (meth)acrylate compound, and a first polymerizable composition containing an ethylenic unsaturated monomer having a tert-butoxy group and a radical polymerization initiator, or a polymer of a second polymerizable composition containing the ethylenic unsaturated monomer having a tert-butoxy group, wherein the amount of the ethylenic unsaturated monomer having a tert-butoxy group is 5 mass % or more and less than 95 mass % with respect to the sum of the amount of the urethane (meth)acrylate compound and the total amount of the monomer(s) contained in the first polymerizable composition or the second polymerizable composition.

The invention relates to a method of producing a fibrillary dry adhesive material having a plurality of fibrils. Furthermore, the invention relates to a fibrillar dry adhesive material in particular having liquid super-repellency.

The invention relates to a method of producing a fibrillary dry adhesive material having a plurality of fibrils. Furthermore, the invention relates to a fibrillar dry adhesive material in particular having liquid super-repellency.

The present application provides an adhesive composition for a foldable display including a thermocurable resin; and a crosslinking agent, wherein the thermocurable resin includes a unit derived from a compound including at least one N or O; and at least one unshared electron pair in the molecule, and the thermocurable resin has a glass transition temperature of −70° C. or lower, an adhesive film using the same, and a foldable display including the same.

The present application provides an adhesive composition for a foldable display including a thermocurable resin; and a crosslinking agent, wherein the thermocurable resin includes a unit derived from a compound including at least one N or O; and at least one unshared electron pair in the molecule, and the thermocurable resin has a glass transition temperature of −70° C. or lower, an adhesive film using the same, and a foldable display including the same.

The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer having no functional group which reacts with the moisture-curable component, and a water content of the base polymer after storage at 25° C. and 50% RH for 24 hours is 0.1% by weight or less, and wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer having no functional group which reacts with the moisture-curable component, and a water content of the base polymer after storage at 25° C. and 50% RH for 24 hours is 0.1% by weight or less, and wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.