A magneto-sensitive wire (magneto-sensitive body) made of a Co-based alloy having a composite structure in which crystal grains are dispersed in an amorphous phase. The Co-based alloy is, for example, a Co—Fe—Si—B-based alloy, and the total amount of Si and B is preferably 20 to 25 at % with respect to the Co-based alloy as a whole. Preferably, the average diameter of the crystal grains is 70 nm or less and the area ratio of the crystal grains is 10% or less to the composite structure as a whole. The magneto-sensitive wire has a circular cross section and the wire diameter is about 1 to 100 μm. Such a magneto-sensitive wire can be obtained, for example, through a heat treatment step of heating an amorphous wire composed of a Co-based alloy at a temperature equal to or higher than a crystallization start temperature and lower than a crystallization end temperature.

A magneto-sensitive wire (magneto-sensitive body) made of a Co-based alloy having a composite structure in which crystal grains are dispersed in an amorphous phase. The Co-based alloy is, for example, a Co—Fe—Si—B-based alloy, and the total amount of Si and B is preferably 20 to 25 at % with respect to the Co-based alloy as a whole. Preferably, the average diameter of the crystal grains is 70 nm or less and the area ratio of the crystal grains is 10% or less to the composite structure as a whole. The magneto-sensitive wire has a circular cross section and the wire diameter is about 1 to 100 μm. Such a magneto-sensitive wire can be obtained, for example, through a heat treatment step of heating an amorphous wire composed of a Co-based alloy at a temperature equal to or higher than a crystallization start temperature and lower than a crystallization end temperature.

This invention aims at providing a carbon-coated metal powder having few impurities, a narrower particle size distribution, and sintering properties particularly suitable as a conductive powder of a conductive paste for forming internal conductors in a ceramic multilayer electronic component obtained by co-firing multilayered ceramic sheets and internal conductor layers; a conductive paste containing the carbon-coated metal powder; a multilayer electronic component using the conductive paste; and a method for manufacturing the carbon-coated metal powder. The carbon-coated metal powder has specific properties in TMA or ESCA measurements. The carbon-coated metal powder can be obtained by melting and vaporizing a metallic raw material in a reaction vessel, conveying the generated metal vapor into a cooling tube and rapidly cooling the metal vapor by endothermically decomposing a carbon source supplied into the cooling tube, and forming a carbon coating film on metal nuclei surfaces in parallel with generation of the metal nuclei.

An aluminized metallic scaffold for high temperature applications comprises a porous non-refractory alloy structure including a network of interconnected pores extending therethrough. The porous non-refractory alloy structure comprises a transition metal phase and an aluminide phase, and portions of the porous non-refractory alloy structure between interconnected pores have a thickness no greater than about 500 nm. A method of making an aluminized metallic scaffold for high-temperature applications comprises introducing aluminum into a surface of a porous metallic structure at an elevated temperature. The porous metallic structure comprises a transition metal and has a network of interconnected pores extending therethrough, where portions of the porous metallic structure between interconnected pores have a thickness no greater than about 500 nm. As the aluminum is introduced into the surface and diffusion occurs, an aluminide phase is formed, resulting in a porous non-refractory alloy structure comprising the aluminide phase and a transition metal phase.

The present invention relates to a sputtering target comprising Ni, W and, optionally, one or more further metal(s) X selected from the group of the refractory metals, Sn, Al and Si, which has a normalized peak intensity ratio
PIR=I.sub.Ni/I.sub.W.Math.(A.sub.W+A.sub.x)/A.sub.Ni of 0.40 or greater, wherein I.sub.Ni is the intensity of the (111) peak of Ni, I.sub.W is the intensity of the (110) peak of W, A.sub.w is the fraction of W in the target in atom %, A.sub.x is the total fraction of the one or more further metals selected from the group of the refractory metals, Sn, Al and Si in the target in atom %, A.sub.Ni is the fraction of Ni in the target in atom %, and wherein the intensities of the peaks are determined by X-ray powder diffraction using Cu-K.sub.alpha radiation.

A field device for processing and automation technology includes a first and a second component that can each be mechanically connected at a joining surface by means of a joining point. Two metal surface layers are each applied at least to the joining surface of the first component and the joining surface of the second component. The metal of the surface layers is different from the metal of the first and/or the metal of the second component. A joining material is applied between the respective joining surfaces of the two components, wherein the joining material includes particles at least partially consisting of a metal that corresponds with the metal of the surface layers The joining of the two components occurs at a joining temperature below 300° C.

The present invention provides a Ni-based alloy, a heat-resistant and corrosion-resistant component, and a heat treatment furnace component, all of which have excellent corrosion resistance and mechanical strength at high temperatures. The Ni-based alloy of the present invention consists of, by mass %, Al: more than 5.0% and up to 26.0%, and Zr: more than 0% and up to 5.0%, the balance being Ni and unavoidable impurities. The Ni-based alloy preferably contains more than 0% and up to 5.0% of B, by mass %, in a combined amount with Zr. Moreover, it is preferable that the Ni-based alloy has P value and Q value and satisfies a relationship of Q value ≥ 0.89 × P value - 0.53, when the P value is obtained from a formula -18.95 + 0.1956 × Ni% + 0.1977 × Al% + 0.2886 × Zr% + 12.4 × B%, and the Q value is obtained by dividing an area percentage of Ni.sub.3Al precipitated on the surface of the alloy by 100.

The disclosure relates to a method for manufacturing a biocompatible wire, a biocompatible wire comprising a biocompatible metallic material and a medical device comprising such wire. The method for manufacturing a biocompatible wire comprises providing a workpiece of a biocompatible metallic material, cold working the workpiece into a wire, and annealing the wire, wherein a cold work percentage is 97 to 99%, wherein the cold working is a drawing with a die reduction per pass ratio in a range of 6 to 40%, and wherein the annealing is done in a range of 850 to 1100° C.

A high melt superalloy powder mixture is provided for use with additive manufacturing or welding metal components or portions thereof. The high melt superalloy powder may include by weight about 7.7% to about 18% chromium, about 10.6% to about 11% cobalt, about 4.5% to about 6.5% aluminum, about 10.6% to about 11% tungsten, about 0.3% to about 0.55% molybdenum, about 0.05% to about 0.08% carbon, and at least 40% nickel.

There is provided a novel Cu bonding wire that achieves a favorable FAB shape and reduces a galvanic corrosion in a high-temperature environment to achieve a favorable bond reliability of the 2nd bonding part. The bonding wire for semiconductor devices includes a core material of Cu or Cu alloy, and a coating layer having a total concentration of Pd and Ni of 90 atomic % or more formed on a surface of the core material. The bonding wire is characterized in that: in a concentration profile in a depth direction of the wire obtained by performing measurement using Auger electron spectroscopy (AES) so that the number of measurement points in the depth direction is 50 or more for the coating layer, a thickness of the coating layer is 10 nm or more and 130 nm or less, an average value X is 0.2 or more and 35.0 or less where X is defined as an average value of a ratio of a Pd concentration C.sub.Pd (atomic %) to an Ni concentration C.sub.Ni (atomic %), C.sub.Pd/C.sub.Ni, for all measurement points in the coating layer, and the total number of measurement points in the coating layer whose absolute deviation from the average value X is 0.3X or less is 50% or more relative to the total number of measurement points in the coating layer.