Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/m or more and 5 mass %/m or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.

Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/m or more and 5 mass %/m or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.

In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm/K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.

The present disclosure discloses use of a copper-chromium alloy in a medical biopsy puncture needle. The copper-chromium alloy used as a material for a needle core and/or needle tube of the puncture needle. The copper-chromium alloy includes the following components by mass: 10≤Cr≤20, 0.04≤Zr≤0.1, and the balance of Cu. According to the present disclosure, a copper alloy with designed components is obtained by combining a diamagnetic material Cu with paramagnetic Cr and Zr, and compared with existing medical stainless steel and titanium alloy, the copper alloy has greatly reduced magnetic susceptibility, and specifically, the artifact area and volume are also significantly reduced. In addition, the blank of use of the copper alloy in medical biopsy paracentesis is filled.

The present disclosure discloses use of a copper-chromium alloy in a medical biopsy puncture needle. The copper-chromium alloy used as a material for a needle core and/or needle tube of the puncture needle. The copper-chromium alloy includes the following components by mass: 10≤Cr≤20, 0.04≤Zr≤0.1, and the balance of Cu. According to the present disclosure, a copper alloy with designed components is obtained by combining a diamagnetic material Cu with paramagnetic Cr and Zr, and compared with existing medical stainless steel and titanium alloy, the copper alloy has greatly reduced magnetic susceptibility, and specifically, the artifact area and volume are also significantly reduced. In addition, the blank of use of the copper alloy in medical biopsy paracentesis is filled.

The present disclosure discloses a copper-niobium alloy for a medical biopsy puncture needle. A needle core and/or needle tube of the puncture needle are/is made of the copper-niobium alloy. The copper-chromium alloy includes the following components by mass: 5≤Nb≤15 and the balance of Cu. According to the present disclosure, a copper alloy with designed components is obtained by combining a diamagnetic material Cu with paramagnetic Nb, and compared with existing medical stainless steel and titanium alloy, the copper alloy has greatly reduced magnetic susceptibility, and specifically, the artifact area and volume are also significantly reduced. In addition, the blank of use of the copper alloy in medical biopsy paracentesis is filled.

The present disclosure discloses a copper-niobium alloy for a medical biopsy puncture needle. A needle core and/or needle tube of the puncture needle are/is made of the copper-niobium alloy. The copper-chromium alloy includes the following components by mass: 5≤Nb≤15 and the balance of Cu. According to the present disclosure, a copper alloy with designed components is obtained by combining a diamagnetic material Cu with paramagnetic Nb, and compared with existing medical stainless steel and titanium alloy, the copper alloy has greatly reduced magnetic susceptibility, and specifically, the artifact area and volume are also significantly reduced. In addition, the blank of use of the copper alloy in medical biopsy paracentesis is filled.

This invention aims at providing a carbon-coated metal powder having few impurities, a narrower particle size distribution, and sintering properties particularly suitable as a conductive powder of a conductive paste for forming internal conductors in a ceramic multilayer electronic component obtained by co-firing multilayered ceramic sheets and internal conductor layers; a conductive paste containing the carbon-coated metal powder; a multilayer electronic component using the conductive paste; and a method for manufacturing the carbon-coated metal powder. The carbon-coated metal powder has specific properties in TMA or ESCA measurements. The carbon-coated metal powder can be obtained by melting and vaporizing a metallic raw material in a reaction vessel, conveying the generated metal vapor into a cooling tube and rapidly cooling the metal vapor by endothermically decomposing a carbon source supplied into the cooling tube, and forming a carbon coating film on metal nuclei surfaces in parallel with generation of the metal nuclei.

This invention aims at providing a carbon-coated metal powder having few impurities, a narrower particle size distribution, and sintering properties particularly suitable as a conductive powder of a conductive paste for forming internal conductors in a ceramic multilayer electronic component obtained by co-firing multilayered ceramic sheets and internal conductor layers; a conductive paste containing the carbon-coated metal powder; a multilayer electronic component using the conductive paste; and a method for manufacturing the carbon-coated metal powder. The carbon-coated metal powder has specific properties in TMA or ESCA measurements. The carbon-coated metal powder can be obtained by melting and vaporizing a metallic raw material in a reaction vessel, conveying the generated metal vapor into a cooling tube and rapidly cooling the metal vapor by endothermically decomposing a carbon source supplied into the cooling tube, and forming a carbon coating film on metal nuclei surfaces in parallel with generation of the metal nuclei.

The present invention is a superconducting wire including: a wire formed of a superconducting material; and a superconducting stabilization material disposed in contact with the wire, in which the superconducting stabilization material is formed of a copper material which contains: one or more types of additive elements selected from Ca, Sr, Ba, and rare earth elements in a total of 3 ppm by mass to 400 ppm by mass; a balance being Cu and inevitable impurities, and in which a total concentration of the inevitable impurities excluding O, H, C, N, and S which are gas components is 5 ppm by mass to 100 ppm by mass.