Disclosed are barrier coatings for fused silica components used in semiconductor processing. In particular, the present disclosure concerns protective substrate-barrier coatings composed of corrosion-resilient metal compounds which provide superior resistance to erosion/corrosion when a coated substrate is subjected to the acidic environments at elevated temperatures typical for semiconductor processing.

A method for producing a glass-like protective layer on an optionally pre-coated metal or glass substrate. The method comprises: (a) mixing one or more defined silicon compounds with NaOH and KOH, (b) adding water to the mixture obtained in (a) to hydrolyze the silicon compound(s), (c) adding at least one defined compound of formula MY.sub.m,
where M is Pb, Ti, Zr, Al or B, to the hydrolyzed mixture obtained in (b), wherein the molar ratio M/Si is from 0.01/1 to 0.04/1, to obtain a coating sol, (d) applying the coating sol obtained in (c) to the substrate, and (e) thermal densification of the coating sol applied in d) at a temperature of from 300° C. to 500° C. to form the glass-like protective layer.

A method for producing a glass-like protective layer on an optionally pre-coated metal or glass substrate. The method comprises: (a) mixing one or more defined silicon compounds with NaOH and KOH, (b) adding water to the mixture obtained in (a) to hydrolyze the silicon compound(s), (c) adding at least one defined compound of formula MY.sub.m,
where M is Pb, Ti, Zr, Al or B, to the hydrolyzed mixture obtained in (b), wherein the molar ratio M/Si is from 0.01/1 to 0.04/1, to obtain a coating sol, (d) applying the coating sol obtained in (c) to the substrate, and (e) thermal densification of the coating sol applied in d) at a temperature of from 300° C. to 500° C. to form the glass-like protective layer.

Methods for fabricating wires insulated by low porosity glass coatings are provided, as are high temperature electromagnetic (EM) devices containing such wires. In embodiments, a method for fabricating a high temperature EM device includes applying a glass coating precursor material onto a wire. The glass coating precursor material contains a first plurality of glass particles having an initial softening point. After application onto the wire, the glass coating precursor material is heat treated under process conditions producing a crystallized intermediary glass coating having a modified softening point exceeding the initial softening point. The crystallized intermediary glass coating is then infiltrated with a filler glass precursor material containing a second plurality of glass particles. After infiltration, the filler glass precursor material is heat treated to consolidate the second plurality of glass particles into the crystallized intermediary glass coating and thereby yield a low porosity glass coating adhered to the wire.

Methods for fabricating wires insulated by low porosity glass coatings are provided, as are high temperature electromagnetic (EM) devices containing such wires. In embodiments, a method for fabricating a high temperature EM device includes applying a glass coating precursor material onto a wire. The glass coating precursor material contains a first plurality of glass particles having an initial softening point. After application onto the wire, the glass coating precursor material is heat treated under process conditions producing a crystallized intermediary glass coating having a modified softening point exceeding the initial softening point. The crystallized intermediary glass coating is then infiltrated with a filler glass precursor material containing a second plurality of glass particles. After infiltration, the filler glass precursor material is heat treated to consolidate the second plurality of glass particles into the crystallized intermediary glass coating and thereby yield a low porosity glass coating adhered to the wire.

A cooking apparatus including an enamel coating layer having an improved cleaning efficiency and a manufacturing method therefor are provided. The cooking apparatus includes a cooking compartment configured to accommodate a cooking object, a door configured to open and close the cooking compartment, and an enamel coating layer provided on a surface of the cooking compartment. The enamel coating layer includes, in percent (%) by weight of the entire composition, 5% or less (excluding 0%) of a silicon dioxide (SiO.sub.2), 10% to 20% of an aluminum oxide (Al.sub.2O.sub.3), 10% to 20% of a phosphorous pentoxide (P.sub.2O.sub.5), 5% to 15% of a rare earth oxide, and 5% to 10% of a ferric oxide (Fe.sub.2O.sub.3).

A cooking apparatus including an enamel coating layer having an improved cleaning efficiency and a manufacturing method therefor are provided. The cooking apparatus includes a cooking compartment configured to accommodate a cooking object, a door configured to open and close the cooking compartment, and an enamel coating layer provided on a surface of the cooking compartment. The enamel coating layer includes, in percent (%) by weight of the entire composition, 5% or less (excluding 0%) of a silicon dioxide (SiO.sub.2), 10% to 20% of an aluminum oxide (Al.sub.2O.sub.3), 10% to 20% of a phosphorous pentoxide (P.sub.2O.sub.5), 5% to 15% of a rare earth oxide, and 5% to 10% of a ferric oxide (Fe.sub.2O.sub.3).

An aluminum member exhibits improved alkali resistance with respect to an anodic oxide coating. The highly alkali-resistant aluminum member includes a material that includes aluminum or an aluminum alloy, an anodic oxide coating that is formed on the surface of the material, and a coating layer that is formed on the anodic oxide coating, and includes a siloxane glass component in a ratio of 90 mass % or more, wherein the coating layer has a thickness of 0.5 to 5.0 μm and a coating mass of 0.4 to 5.0 g/m.sup.2.

An aluminum member exhibits improved alkali resistance with respect to an anodic oxide coating. The highly alkali-resistant aluminum member includes a material that includes aluminum or an aluminum alloy, an anodic oxide coating that is formed on the surface of the material, and a coating layer that is formed on the anodic oxide coating, and includes a siloxane glass component in a ratio of 90 mass % or more, wherein the coating layer has a thickness of 0.5 to 5.0 μm and a coating mass of 0.4 to 5.0 g/m.sup.2.

An object having a high temperature resistance includes an inorganic substrate, an omniphobic non-stick coating, and an adhesion-promoting coating containing amorphic silicon dioxide and located between the inorganic substrate and the omniphobic non-stick coating.