Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/m or more and 5 mass %/m or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.

A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

In some embodiments, a coating applied to steel reinforcement bar (e.g., steel rebar) that could considerably extend the lifetime of concrete structures by reducing steel rebar corrosion is disclosed. The coating includes a thin, passivating steel (e.g., stainless steel) layer that is applied to the outside of conventional steel rebar. The coating can be applied in-line through metal cold spray manufacturing, which is a high throughput coating technique that can be integrated into existing steel manufacturing plants. Furthermore, a novel, high performance ferritic steel with tailored resistance to corrosion from chlorides is described. The new ferritic steel is distinct from other commercial and experimental steels, and is better suited for coating low-cost steel structures like rebar. Multiple alloying elements including Cr, Al, and Si will each form protective oxides independently, increasing the total amount of protection and extending it over much wider ranges of pH and electrical potential.

The high-strength plated steel sheet of the present invention has a plated layer on the surface of a base steel sheet and contains predetermined steel components. The steel sheet includes, in the order from the interface of the base steel sheet and the plated layer towards the base steel sheet: a soft layer having a Vickers hardness that is 90% or less of the Vickers hardness at a portion t/4 of the base steel sheet, where t is a sheet thickness of the base steel sheet: and a hard layer containing martensite, bainite, and ferrite in predetermined ranges. The average depth D of the soft layer is 20 μm or greater, and the average depth d of an internal oxide layer is 4 μm or greater and smaller than D.

Equipment for the continuous hot dip-coating of a metal strip 9 including an annealing furnace, a tank 2 containing a liquid metal bath 3, a snout connecting the annealing furnace and tank 2, through which the metal strip 9 runs in a protective atmosphere and the lower part of the snout, the sabot 5, is at least partly immersed in the liquid metal bath 3 in order to define with the surface of the bath, and inside this snout, a liquid seal 6, an overflow 7 not connected to the snout, the overflow 7 including at least one tray 8, placed in the vicinity of the strip 9 when entering the liquid metal bath 3 and encompassed by liquid seal 6.

Equipment for the continuous hot dip-coating of a metal strip 9 including an annealing furnace, a tank 2 containing a liquid metal bath 3, a snout connecting the annealing furnace and tank 2, through which the metal strip 9 runs in a protective atmosphere and the lower part of the snout, the sabot 5, is at least partly immersed in the liquid metal bath 3 in order to define with the surface of the bath, and inside this snout, a liquid seal 6, an overflow 7 not connected to the snout, the overflow 7 including at least one tray 8, placed in the vicinity of the strip 9 when entering the liquid metal bath 3 and encompassed by liquid seal 6.

Exemplary methods of coating a semiconductor component substrate may include submerging the semiconductor component substrate in an alkaline electrolyte. The alkaline electrolyte may include yttrium. The methods may include igniting a plasma at a surface of the semiconductor component substrate for a period of time less than or about 12 hours. The methods may include forming a yttrium-containing oxide on the semiconductor component substrate. A surface of the yttrium-containing oxide may be characterized by a yttrium incorporation of greater than or about 10 at. %.

According to one embodiment, a wet-area device includes a main part, a first layer, and a second layer. The first layer is provided on an outer surface of the main part. The second layer is provided on an outer surface of the first layer. A hardness of the second layer is greater than a hardness of the first layer. The first layer includes a first unevenness at a side of the outer surface of the first layer. The first unevenness includes a plurality of recesses and a plurality of protrusions. The second layer includes a second unevenness at a side of an outer surface of the second layer. The second unevenness includes a plurality of recesses and a plurality of protrusions. The second unevenness is arranged along the first unevenness. An average height of the first unevenness is less than an average length of the first unevenness.

The present invention is a system and method for electroplating and etching, which provides a solution to the problem of smoothing rough exterior features of a 3D printed or otherwise roughly manufactured object with rough exterior features. The core components of the invention are an acid bath with a first electrode and a target object as a second electrode which are in the acid bath. The first electrode and the target object are connected to a power source that causes a current to run in a first direction to etch the target object and in a second direction to plate on the target object. The amount of different metals dissolved in the acid solution will affect the composition of plated material on the target object.