Patent classifications
C25D11/00
METHODS OF FORMING A METAL COATED ARTICLE
A method of forming a metal coated article, comprises forming a metal halide in a molten salt plating bath at a first temperature, wherein forming the metal halide in the molten salt further comprises forming at least one functional metal halide electrolyte; and forming at least two auxiliary metal halide electrolytes at eutectic conditions; increasing the first temperature to a second temperature; forming a plated metal coating from the at least one functional metal halide electrolyte, onto a thermally conductive substrate; and introducing at least one of deuterium and tritium into the plated metal coating.
METHODS OF FORMING A METAL COATED ARTICLE
A method of forming a metal coated article, comprises forming a metal halide in a molten salt plating bath at a first temperature, wherein forming the metal halide in the molten salt further comprises forming at least one functional metal halide electrolyte; and forming at least two auxiliary metal halide electrolytes at eutectic conditions; increasing the first temperature to a second temperature; forming a plated metal coating from the at least one functional metal halide electrolyte, onto a thermally conductive substrate; and introducing at least one of deuterium and tritium into the plated metal coating.
Plasma electrolytic oxidation apparatus and method of plasma electrolytic oxidation using the same
In a plasma electrolytic oxidation apparatus and a method of plasma electrolytic oxidation using the plasma electrolytic oxidation apparatus, the plasma electrolytic oxidation apparatus includes a chamber and an electrode unit. The chamber is configured to receive an electrolyte. The electrode unit is configured to receive the electrolyte from the chamber and to treat an object with a plasma electrolytic oxidation treatment. The electrode unit includes an electrode, an enclosing part and a cover. The electrode is configured to receive a voltage from outside, and to form a receiving space in which the electrolyte is received between the electrode and the object. The enclosing part is configured to enclose a gap between the electrode and the object. The cover is configured to cover the electrode.
MULTIPLE WAFER SINGLE BATH ETCHER
An etcher comprises a bath, a plurality of blades, and a tunnel. The bath includes a first electrode at a first end and a second electrode at a second end. The plurality of blades is configured to fit in the bath. At least one blade of the plurality of blades holds a wafer. At least one tunnel is configured to fit between adjacent blades of the plurality of blades in the bath.
METHOD FOR PASSIVATING A TINPLATE STRIP AND APPARATUS FOR PRODUCING SAID PASSIVATED TINPLATE STRIP
A method for passivating a tinplate strip after electrodepositing the tin layer or tin layers, or after an optional flow-melting of the electrodeposited tin layer or tin layers, and an apparatus for producing the passivated tinplate strip.
Method for doping using electric field
A doping method using an electric field includes stacking a sacrificial layer on a doped layer, disposing a doping material on the sacrificial layer, disposing electrodes on the doping material and the doped layer, respectively, and doping the doping material into the doped layer through oxidation, diffusion, and reduction of the doping material by the electric field.
Methods for electrolytically depositing pretreatment compositions
Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.
METHOD AND SYSTEM FOR PRODUCTION OF ANTIMICROBIAL DISINFECTANT COATINGS USING ELECTROCHEMICAL SYNTHESIS
The present disclosure provides a method and system for producing antimicrobial compositions comprising transition metal ions which are generated electrolytically in aqueous solution; chelating agent and excipients; wherein the said ionic species thereby impart stability and longer shelf life and long-term efficacy. Owing to the neutral pH, colorless, odorless, tasteless, non-caustic, non-corrosive nature, the composition of example embodiments shall be used as surface disinfectant and food contact sanitizer and provides an unparalleled combination of high efficacy and low toxicity with instant kill and long-term efficacy. The specific combination of certain metals provides the ability to be extremely broad spectrum and thus works against virus, bacteria, fungi, mold, mildew and antibiotic resistant species as well.
Anodized part having low reflectance of visible and near-infrared light
This application relates to an enclosure for a portable electronic device. The enclosure includes a metal substrate, and an anodized layer overlaying the metal substrate and including pores having a near-infrared (NIR) light-absorbing material therein, where an average specular reflectance of NIR light that is incident upon an external surface of the anodized layer is less than 3%.
ELECTROLYTIC PROCESSING OF METALLIC SUBSTRATES
Provided herein are methods and systems for electrolytic processing of metallic substrates, such as aluminum alloys. The disclosure provides methods of making an anodized substrate by anodizing a metallic substrate in an electrolyte solution comprising phosphoric acid. In particular, the disclosure describes various conditions for anodizing the metallic substrate, including temperature, acid concentration, and voltage. The disclosure also provides systems for carrying out described methods.