Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.

Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.

Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging.

Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging.

Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.

Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.

There is provided a cleaning method and a cleaning apparatus capable of removing dirt on electrical contacts, the dirt being unable to be removed with deionized water, without adversely affecting a plating solution and a substrate holder which is a member for holding a substrate. A cleaning method according to the present disclosure is a cleaning method for a substrate holder having electrical contacts for supplying electric power to a substrate by contacting the substrate to plate the substrate, the method including a cleaning step of cleaning the electrical contacts attached to the substrate holder with a citric acid aqueous solution.

There is provided a cleaning method and a cleaning apparatus capable of removing dirt on electrical contacts, the dirt being unable to be removed with deionized water, without adversely affecting a plating solution and a substrate holder which is a member for holding a substrate. A cleaning method according to the present disclosure is a cleaning method for a substrate holder having electrical contacts for supplying electric power to a substrate by contacting the substrate to plate the substrate, the method including a cleaning step of cleaning the electrical contacts attached to the substrate holder with a citric acid aqueous solution.

A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.

A film deposition device (1A) of a metal film includes: a solid electrolyte membrane (13) that allows metal ions to be contained; a positive electrode (11) made of a porous body; a power supply part (14) that applies a voltage between the positive electrode and a base material; and a contact pressurization part (20) that comes into contact with the positive electrode (11) and uniformly pressurizes a film deposition region of a surface of the base material by the solid electrolyte membrane (13) via the positive electrode (11). The positive electrode (11) made of the porous body is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane. The power supply part (14) applies a voltage between the positive electrode and the base material so that the metal film made of the metal is deposited.