A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 .Math.m to 2.0 .Math.m. The wiring lines have an average height of 40 .Math.m to 120 .Math.m. The wiring lines have an average spacing of 1 .Math.m to 30 .Math.m.

Provided is a metal component that is configured to be used for manufacturing a semiconductor device, the metal component including: a substrate having a conductivity; and a noble metal plating layer formed on all or part of a surface of the substrate, wherein the noble metal plating layer has a surface with irregularities, and a protrusion of the irregularities has an aspect ratio of 0.3 or more.

A method of forming a metal coated article, comprises forming a metal halide in a molten salt plating bath at a first temperature, wherein forming the metal halide in the molten salt further comprises forming at least one functional metal halide electrolyte; and forming at least two auxiliary metal halide electrolytes at eutectic conditions; increasing the first temperature to a second temperature; forming a plated metal coating from the at least one functional metal halide electrolyte, onto a thermally conductive substrate; and introducing at least one of deuterium and tritium into the plated metal coating.

The presently disclosed subject matter relates to devices, systems, and methods for fabricating a solid polymer electrolyte electrode assembly are provided. One or more electrode for a solid polymer electrolyte electrode assembly includes a porous substrate configured as a liquid/gas diffusion layer and an ionomer-free catalyst coated on the substrate.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

The purpose of the present invention is to provide a zinc-nickel-silica composite plating bath that has been improved in terms of: covering power for articles having a complex shape; and corrosion resistance of a low current density portion where the film thickness is small. The present invention pertains to a zinc-nickel-silica composite plating bath, the plating bath having a pH of 3.5 to 6.9, and containing zinc ions, nickel ions, colloidal silica, and chloride ions. The colloidal silica is a cationic colloidal silica having on the surface thereon at least one species of metal cation selected from the group consisting of trivalent to heptavalent metal cations.

This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D).

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In General Formula (1), m is an integer of 1 to 3, n is an integer of 10 to 30, and X is a cation.

The present invention provides multilayer coated substrates, prepared using primer and/or sealer compositions comprising waterborne curable film-forming compositions, in turn comprising: a) an aqueous dispersion of a pigment and i) polymeric urethane-shell particles having a care-shell morphology and having hydroxyl functional groups, wherein the core is prepared from a monomer mixture comprising hydrophobic, ethylenically unsaturated monomers and the shell comprises a polyurethane or polyurethane-urea polymer; or ii) polymeric acrylic-shell particles having a core-shell morphology and having hydroxyl functional groups, wherein the core is prepared from a monomer mixture comprising hydrophobic, ethylenically unsaturated monomers and the shell is prepared from a monomer mixture comprising hydrophilic, ethylenically unsaturated monomers; b) a polyisocyanate crosslinking agent; and optionally c) a hydroxyl functional, water dispersible acrylic polymer.