Patent classifications
C25F7/00
Process and Device for Producing a Coated Structural Component
The present invention relates to a method of manufacturing a coated structural component (10) for a vehicle, comprising the steps of: providing a base component (11), hot forming the base component (11) into a molded component (12), electrochemically deburring the molded component (12), and electrolytically applying a corrosion protection layer (13) to the deburred molded component (12) to produce the structural component (10). The invention further relates to an apparatus for carrying out a method according to the invention for producing a deburred and coated structural component.
Device and method for electrochemically processing a material
The invention relates to a method and a device for electrochemically processing a material, which contains a hard phase and a binder phase. The method comprises preparing an aqueous, alkaline, complexing-agent-containing electrolyte and bringing the material to be processed into contact at least in part with the electrolyte and with a current source. In order to electrochemically oxidize the material, a pulsed electrical current is delivered to the material by means of the current source, the pulse sequence of the delivered electrical current being adjusted to the amount of the binder phase in the material to be processed. By means of the method and by means of the device, it is also possible to process materials having a high content of binder phase in such a way that matter can be removed from the material evenly (homogeneously), i.e. both from the hard phase and from the binder phase of the material.
Device and method for electrochemically processing a material
The invention relates to a method and a device for electrochemically processing a material, which contains a hard phase and a binder phase. The method comprises preparing an aqueous, alkaline, complexing-agent-containing electrolyte and bringing the material to be processed into contact at least in part with the electrolyte and with a current source. In order to electrochemically oxidize the material, a pulsed electrical current is delivered to the material by means of the current source, the pulse sequence of the delivered electrical current being adjusted to the amount of the binder phase in the material to be processed. By means of the method and by means of the device, it is also possible to process materials having a high content of binder phase in such a way that matter can be removed from the material evenly (homogeneously), i.e. both from the hard phase and from the binder phase of the material.
MULTIPLE WAFER SINGLE BATH ETCHER
An etcher comprises a bath, a plurality of blades, and a tunnel. The bath includes a first electrode at a first end and a second electrode at a second end. The plurality of blades is configured to fit in the bath. At least one blade of the plurality of blades holds a wafer. At least one tunnel is configured to fit between adjacent blades of the plurality of blades in the bath.
MULTIPLE WAFER SINGLE BATH ETCHER
An etcher comprises a bath, a plurality of blades, and a tunnel. The bath includes a first electrode at a first end and a second electrode at a second end. The plurality of blades is configured to fit in the bath. At least one blade of the plurality of blades holds a wafer. At least one tunnel is configured to fit between adjacent blades of the plurality of blades in the bath.
Copper catalysts for electrochemical CO.SUB.2 .reduction to C.SUB.2+ .products
An electrochemical method includes performing anodic halogenation of Cu foils, performing subsequent oxide-formation in a KHCO.sub.3 electrolyte, and performing an electroreduction in neutral KHCO.sub.3 to generate a copper catalyst.
Copper catalysts for electrochemical CO.SUB.2 .reduction to C.SUB.2+ .products
An electrochemical method includes performing anodic halogenation of Cu foils, performing subsequent oxide-formation in a KHCO.sub.3 electrolyte, and performing an electroreduction in neutral KHCO.sub.3 to generate a copper catalyst.
Sequenced pulse reverse waveform surface finishing of additively manufactured parts
A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic. The power supply is operated to decrease the surface roughness of the part by applying a first series of waveforms including at least two waveforms where a diffusion layer is maintained at a thickness to produce a macroprofile regime relative to the macroasperities, the first series of waveforms having anodic voltages applied for anodic time periods before cathodic voltages applied for cathodic time periods to effect part surface smoothing to a first surface roughness with minimal material removal and applying a final waveform where the diffusion layer represents a microprofile regime, the final waveform having a final anodic voltage applied for a final anodic time period before a final cathodic voltage applied for a final cathodic time period to effect part surface smoothing to a final surface roughness with minimal material removal.
Sequenced pulse reverse waveform surface finishing of additively manufactured parts
A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic. The power supply is operated to decrease the surface roughness of the part by applying a first series of waveforms including at least two waveforms where a diffusion layer is maintained at a thickness to produce a macroprofile regime relative to the macroasperities, the first series of waveforms having anodic voltages applied for anodic time periods before cathodic voltages applied for cathodic time periods to effect part surface smoothing to a first surface roughness with minimal material removal and applying a final waveform where the diffusion layer represents a microprofile regime, the final waveform having a final anodic voltage applied for a final anodic time period before a final cathodic voltage applied for a final cathodic time period to effect part surface smoothing to a final surface roughness with minimal material removal.
Polishing method for inner wall of hollow metal part
A polishing method for an inner wall of a hollow metal part, including: firstly, placing a coaxial cathode in an inner hole of a metal part when a metal part model is designed, and printing the metal part model and the coaxial cathode together; then, sealing two ends of an inner hole cavity of the metal part by using a light curing part, fixing the coaxial cathode, filling the cavity with a polishing solution, and performing polishing treatment by using an electrochemical polishing method; and finally, reversing an electrode to break the coaxial cathode and take out the broken coaxial cathode to obtain a polished metal part. The polishing of a complex-shaped inner hole of a 3D-printed metal part is realized, the defect that an inner hole of a 3D-printed metal part with a complex-shaped hollow part cannot be polished by using a traditional machining method is overcome, the problem that an inner wall of a metal part polished by using an electrochemical method is non-uniform is solved, the surface quality of the inner hole of the 3D-printed metal part with the complex-shaped hollow part is improved, and the application prospect and postprocessing technology of the 3D-printed metal part are expanded.