A magnet coil for magnetic Czochralski single crystal growth includes: a first coil, a second coil, and an auxiliary coil arranged between the first coil and the second coil. A distance between the first coil and a first edge of the auxiliary coil close to the first coil is equal to a distance between the second coil and a second edge of the auxiliary coil close to the second coil. The auxiliary coil, the first coil and the second coil have a common central axis. When being energized, a direction of a current in the first coil is opposite to a direction of a current in the second coil, and a magnetic field generated by a current in the auxiliary coil is used for enhancing a cusp magnetic field between the first coil and the second coil.

A magnet coil for magnetic Czochralski single crystal growth includes: a first coil, a second coil, and an auxiliary coil arranged between the first coil and the second coil. A distance between the first coil and a first edge of the auxiliary coil close to the first coil is equal to a distance between the second coil and a second edge of the auxiliary coil close to the second coil. The auxiliary coil, the first coil and the second coil have a common central axis. When being energized, a direction of a current in the first coil is opposite to a direction of a current in the second coil, and a magnetic field generated by a current in the auxiliary coil is used for enhancing a cusp magnetic field between the first coil and the second coil.

A mono-crystalline silicon growth apparatus is provided. The mono-crystalline silicon growth apparatus includes a furnace, a support base disposed in the furnace, a crucible disposed on the support base, and a heating module. The support base and the crucible do not rotate relative to the heating module, and an axial direction is defined to be along a central axis of the crucible. The heating module is disposed at an outer periphery of the support base and includes a first heating unit, a second heating unit, and a third heating unit. The first heating unit, the second heating unit, and the third heating unit are respectively disposed at positions with different heights corresponding to the axial direction.

An apparatus for manufacturing a single crystal by growing a single crystal according to a Czochralski method, the apparatus including: main chamber configured to house crucible configured to accommodate raw-material melt, and heater configured to heat raw-material melt; pulling chamber continuously provided at upper portion of main chamber and configured to accommodate single crystal grown and pulled; cooling cylinder extending from at least ceiling portion of main chamber toward raw-material melt so as to surround single crystal being pulled, cooling cylinder configured to be forcibly cooled with coolant; and auxiliary cooling cylinder fitted in an inside of cooling cylinder. Auxiliary cooling cylinder is made of any one or more materials of graphite, carbon composite, stainless steel, molybdenum, and tungsten. The auxiliary cooling cylinder has structure covering bottom surface of cooling cylinder facing raw-material melt. Gap between auxiliary cooling cylinder and bottom surface of cooling cylinder is 1.0 mm or less.

An apparatus for manufacturing a single crystal by growing a single crystal according to a Czochralski method, the apparatus including: main chamber configured to house crucible configured to accommodate raw-material melt, and heater configured to heat raw-material melt; pulling chamber continuously provided at upper portion of main chamber and configured to accommodate single crystal grown and pulled; cooling cylinder extending from at least ceiling portion of main chamber toward raw-material melt so as to surround single crystal being pulled, cooling cylinder configured to be forcibly cooled with coolant; and auxiliary cooling cylinder fitted in an inside of cooling cylinder. Auxiliary cooling cylinder is made of any one or more materials of graphite, carbon composite, stainless steel, molybdenum, and tungsten. The auxiliary cooling cylinder has structure covering bottom surface of cooling cylinder facing raw-material melt. Gap between auxiliary cooling cylinder and bottom surface of cooling cylinder is 1.0 mm or less.

Methods for forming a unitized crucible assembly for holding a melt of silicon for forming a silicon ingot are disclosed. In some embodiments, the methods involve a porous crucible mold having a channel network with a bottom channel, an outer sidewall channel that extends from the bottom channel, and a central weir channel that extends from the bottom channel. A slip slurry may be added to the channel network and the liquid carrier of the slip slurry may be drawn into the mold. The resulting green body may be sintered to form the crucible assembly.

Provided are a method of polishing a silicon wafer and a method of producing a silicon wafer which can reduce the formation of step-forming microdefects on a silicon wafer. The method includes: a double-side polishing step of performing polishing on front and back surfaces of a silicon wafer; a notch portion polishing step of performing polishing on a beveled portion of a notch portion of the silicon wafer after the double-side polishing step; a peripheral beveled portion polishing step of performing polishing on the beveled portion on the periphery of the silicon wafer other than the beveled portion of the notch portion after the notch portion polishing step; and a finish polishing step of performing finish polishing on the front surface of the silicon wafer after the peripheral beveled portion polishing step. The notch portion polishing step is performed in a state where the front surface is wet with water.

Provided are a method of polishing a silicon wafer and a method of producing a silicon wafer which can reduce the formation of step-forming microdefects on a silicon wafer. The method includes: a double-side polishing step of performing polishing on front and back surfaces of a silicon wafer; a notch portion polishing step of performing polishing on a beveled portion of a notch portion of the silicon wafer after the double-side polishing step; a peripheral beveled portion polishing step of performing polishing on the beveled portion on the periphery of the silicon wafer other than the beveled portion of the notch portion after the notch portion polishing step; and a finish polishing step of performing finish polishing on the front surface of the silicon wafer after the peripheral beveled portion polishing step. The notch portion polishing step is performed in a state where the front surface is wet with water.

An apparatus having an asymmetric adjustable lens with a deformable optical element. The apparatus may also include one or more actuators coupled to a deformable element of the asymmetric adjustable lens in a direct-drive configuration such that (1) mechanical action of the one or more actuators applies force to the deformable optical element and (2) the force applied by the mechanical action of the one or more actuators changes an optical property of the asymmetric adjustable lens by deforming the deformable optical element. Various other devices, systems, and methods are also disclosed.

A method of evaluating metal contamination by measuring the amount of metal contaminants to a silicon wafer in a rapid thermal processing apparatus includes steps of obtaining a Si single crystal grown by the Czochralski method at a pulling rate of 1.0 mm/min or lower, the crystal having oxygen concentration of 1.3×10.sup.18 atoms/cm.sup.3 or less, slicing silicon wafers from the Si single crystal except regions of 40 mm toward the central portion from the head of the single crystal and 40 mm toward the central portion from the tail, heat-treating the silicon wafer with a rapid thermal processing apparatus and transferring contaminants from members in a furnace of the rapid thermal processing apparatus to the silicon wafer, and measuring a lifetime of the silicon wafer to which contaminants are transferred.