A valve opening circuit mounted on a heat pump device having a valve on a refrigerant circuit includes a DC electric path to which a DC voltage generated from an AC voltage for normal use is applied, a valve drive circuit that opens and closes the valve by using the DC voltage of the DC electric path, a control unit that acquires a control power source voltage based on the DC voltage of the DC electric path and controls the valve drive circuit, and a power feed port connected to the DC electric path and connectable to a DC power source line provided from outside for emergency. The control unit causes the valve drive circuit to open the valve when the AC voltage is lost and the DC voltage is fed from the DC power source line to the power feed port.

A valve opening circuit mounted on a heat pump device having a valve on a refrigerant circuit includes a DC electric path to which a DC voltage generated from an AC voltage for normal use is applied, a valve drive circuit that opens and closes the valve by using the DC voltage of the DC electric path, a control unit that acquires a control power source voltage based on the DC voltage of the DC electric path and controls the valve drive circuit, and a power feed port connected to the DC electric path and connectable to a DC power source line provided from outside for emergency. The control unit causes the valve drive circuit to open the valve when the AC voltage is lost and the DC voltage is fed from the DC power source line to the power feed port.

The invention provides a heat pump system comprising a base support; a top support and one or more elongated support structures connected to the base support and the top support. A hydraulic system configured to provide a compression stress to at least one SMA or NTE or elastocaloric core during use. An inlet for receiving fluid and an outlet for exiting the fluid; and at least one valve configured to control the inlet and the outlet. The elongated support is configured to engage with the SMA core to prevent the SMA material buckling when a compression stress is applied.

The invention provides a heat pump system and method heat pump system comprising a first Shape-Memory Alloy (SMA) or Negative Thermal Expansion (NTE) elastocaloric material core positioned in a housing and adapted to change state in response a temperature change supplied by a fluid. A second Shape-Memory Alloy (SMA) or Negative Thermal Expansion (NTE) elastocaloric material core positioned in a housing and adapted to change state in response a temperature change supplied by the fluid. A pump mechanism connected in a fluid communication with the first core and second core and adapted to control delivery of the fluid to the first and second core.

A heat exchanger according to an embodiment of the present disclosure includes a housing, a gas inflow pipe configured to flow exhaust gas in the housing and a gas exhaust pipe configured to discharge the exhaust gas to the outside of the housing, a cooling water inflow pipe configured to flow cooling water in the housing and a cooling water outflow pipe configured to flow out the cooling water heat-exchanged with the exhaust gas to the outside of the housing, a plurality of tubes extending in the housing in the longitudinal direction of the housing and through which the cooling water flowing therein through the cooling water inflow pipe flows, and a plurality of baffles which are installed in the housing to insert the plurality of tubes thereinto and which are spaced apart from each other by a predetermined distance and are disposed, in which the baffle may be a first curved part configured to extend to be rounded with a first curvature, a first straight part configured to extend linearly from one end part of the first curved part, a second straight part configured to extend linearly from the other end part of the first curved part, and a second curved part positioned between the first and second straight parts and configured to extend to be rounded with a second curvature, and the first straight part and the second straight part may be formed in a direction crossing each other.

A refrigerant leakage detection sensor for a heat pump includes a sensor casing, a circuit board enclosed by the sensor casing, and a gas sensor mounted on the circuit board. The gas sensor has a housing, a refrigerant reception area at an end of the housing allowing gaseous refrigerant to enter the housing, and a sensing element in the housing. The housing protrudes through an opening in the sensor casing so that the refrigerant reception area is arranged outside the sensor casing and the sensing element is positioned inside the sensor casing.

A refrigerant leakage detection sensor for a heat pump includes a sensor casing, a circuit board enclosed by the sensor casing, and a gas sensor mounted on the circuit board. The gas sensor has a housing, a refrigerant reception area at an end of the housing allowing gaseous refrigerant to enter the housing, and a sensing element in the housing. The housing protrudes through an opening in the sensor casing so that the refrigerant reception area is arranged outside the sensor casing and the sensing element is positioned inside the sensor casing.

A heat pump system and a cooling/heating system using same, the heat pump system being able to prevent the occurrence of a vortex in a process in which fluid flows into a heat storage tank, and to supply and maintain constant-temperature cooling and heating. The heat pump system according to the present invention includes: an indoor unit which functions as a condenser during heating and functions as an evaporator during cooling; an outdoor unit which functions as an evaporator during heating and functions as a condenser during cooling; a heating medium for heat exchange; and a heat storage tank in which the heating medium for cold/hot water is stored.

A heat pump system and a cooling/heating system using same, the heat pump system being able to prevent the occurrence of a vortex in a process in which fluid flows into a heat storage tank, and to supply and maintain constant-temperature cooling and heating. The heat pump system according to the present invention includes: an indoor unit which functions as a condenser during heating and functions as an evaporator during cooling; an outdoor unit which functions as an evaporator during heating and functions as a condenser during cooling; a heating medium for heat exchange; and a heat storage tank in which the heating medium for cold/hot water is stored.

A heat pump for a pool or spa may include a human-machine interface (HMI). The HMI of the heat pump may be movable relative to a housing or body of the heat pump such that regardless of the location and orientation of the installation of the body of the heat pump, the HMI may be positioned so that it is accessible to a user. A heat pump may additionally or alternatively include means for managing condensate created by operation of said heat pump.