An apparatus for thermal interface material detection includes a heat dissipating device stack up that includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board. The heat dissipating device is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heat dissipating device includes an embedded conductive probe, where a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.

A liquid cooling jacket includes a refrigerant flow path which is a flow path having a width in a second direction and in which a heat dissipation assembly is located on a first side in a third direction, where a direction in which a refrigerant flows is defined as a first direction. The refrigerant flow path includes a narrow flow path portion. A width in the third direction of the narrow flow path portion is smaller than a width in the third direction of a flow path on a first side in the first direction with respect to the narrow flow path portion and a width in the third direction of a flow path on a second side in the first direction with respect to the narrow flow path portion.

A liquid cooling jacket includes a refrigerant flow path which is a flow path having a width in a second direction and in which a heat dissipation assembly is located on a first side in a third direction, where a direction in which a refrigerant flows is defined as a first direction. The refrigerant flow path includes a narrow flow path portion. A width in the third direction of the narrow flow path portion is smaller than a width in the third direction of a flow path on a first side in the first direction with respect to the narrow flow path portion and a width in the third direction of a flow path on a second side in the first direction with respect to the narrow flow path portion.

Provided are methods and systems for converting a passive cooling system into an active hydronic ground cooling system. In an aspect, an existing passive cooling device can be first discharged of working fluid. An existing pipe of the passive cooling system can then be cut to a predetermined height. A top portion of the existing pipe can be threaded and fitted with a cap base. Tubing can then be installed within the existing pipe. A cap can be attached to the cap base. The tubing can be attached to a chiller system and filled with coolant. Similar procedure can be applied to convert a thermopile or traditional pipe pile to into an active cooling system.

Provided are methods and systems for converting a passive cooling system into an active hydronic ground cooling system. In an aspect, an existing passive cooling device can be first discharged of working fluid. An existing pipe of the passive cooling system can then be cut to a predetermined height. A top portion of the existing pipe can be threaded and fitted with a cap base. Tubing can then be installed within the existing pipe. A cap can be attached to the cap base. The tubing can be attached to a chiller system and filled with coolant. Similar procedure can be applied to convert a thermopile or traditional pipe pile to into an active cooling system.

A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.

A vehicle includes a refrigerant system having a chiller and a coolant system having a chiller loop and a radiator loop. The chiller loop is arranged to circulate coolant through the chiller, and the radiator loop is arranged to circulate coolant through a battery, a radiator, and a bypass valve connected to a bypass conduit. A controller is configured to, in response to an ambient-air temperature exceeding a battery-coolant temperature, actuate the valve to circulate coolant to the bypass conduit to skip the radiator.

Electronic devices are disclosed including hydrophobic or oleophobic coatings that control coolant flow therein or thereon. In at least one embodiment, a power inverter cold plate is provided including coolant inlet, a coolant outlet, a coolant flow spreading region, a coolant flow collection region, and a coolant heat-transfer region disposed therebetween; and one or more layers of a hydrophobic or oleophobic coating configured to control a flow of coolant in the cold plate. A method may include applying one or more layers of a hydrophobic or oleophobic coating to a power inverter cold plate to control a flow of coolant in the cold plate, the one or more layers being applied to one or more of a coolant flow spreading region, a coolant flow collection region, or a coolant heat-transfer region disposed therebetween. The layers may define coolant flow paths, eliminate recirculation zones, and/or prevent coolant leak paths.

Electronic devices are disclosed including hydrophobic or oleophobic coatings that control coolant flow therein or thereon. In at least one embodiment, a power inverter cold plate is provided including coolant inlet, a coolant outlet, a coolant flow spreading region, a coolant flow collection region, and a coolant heat-transfer region disposed therebetween; and one or more layers of a hydrophobic or oleophobic coating configured to control a flow of coolant in the cold plate. A method may include applying one or more layers of a hydrophobic or oleophobic coating to a power inverter cold plate to control a flow of coolant in the cold plate, the one or more layers being applied to one or more of a coolant flow spreading region, a coolant flow collection region, or a coolant heat-transfer region disposed therebetween. The layers may define coolant flow paths, eliminate recirculation zones, and/or prevent coolant leak paths.

A cooling system for electrical and optical devices includes an electrocaloric cooler (EEC). A fluid circuit is in thermal communication with the EEC to dump heat from a working fluid of the fluid circuit into the EEC. The system can include a second EEC, a second fluid circuit in thermal communication with the second EEC to dump heat from a working fluid of the second fluid circuit into the EEC, and a second heat sink in thermal communication with the second fluid circuit to dump heat into the working fluid of the second fluid circuit. The second EEC, second fluid circuit, and second heat sink can be cascaded with the first EEC, first heat sink, and first fluid circuit wherein the second heat sink is in thermal communication with the first EEC to accept heat therefrom.