Patent classifications
F28F21/00
HEAT TRANSFER UTILIZING VASCULAR COMPOSITES AND FIELD INDUCED FORCES
A system includes a matrix material to remove heat from an object. The matrix material includes a plurality of vascular structures. Each of the vascular structures are filled with a fluid. At least one transducer generates field-induced forces into the fluid within the vascular structures of the matrix material. At least one controller pulses the transducer to generate the field-induced forces into the fluid within the vascular structures. The field-induced forces generate fluid flow within the vascular structures to remove the heat from the object.
HEAT TRANSFER UTILIZING VASCULAR COMPOSITES AND FIELD INDUCED FORCES
A system includes a matrix material to remove heat from an object. The matrix material includes a plurality of vascular structures. Each of the vascular structures are filled with a fluid. At least one transducer generates field-induced forces into the fluid within the vascular structures of the matrix material. At least one controller pulses the transducer to generate the field-induced forces into the fluid within the vascular structures. The field-induced forces generate fluid flow within the vascular structures to remove the heat from the object.
Multi mode heat transfer systems
Embodiments described herein generally relate to a multi-mode heat transfer system. The heat transfer system includes an emitter device. The emitter device includes an inner core surrounded by an outer core having a thickness and an outer surface. A composite material pattern extends through at least a portion of the outer surface and at least a portion of the thickness of the outer core and is thermally coupled to the inner core. The composite material pattern in combination with an optimized emissivity surface coating/paint profile directs a heat from the inner core to an object other than the emitter device.
EXCHANGER DEVICE
The invention relates to an exchanger device comprising a first and a second end piece (1, 2) and an exchanger body (3, 4) arranged in-between. At least one first and one second channel (150, 151) in the exchanger body (3, 4) connect inlets and outlets (10, 11, 20, 21) of the two end pieces (1, 2), wherein the inlets and outlets (10, 11, 20, 21) are arranged in end faces of the end pieces (1, 2), which face away from the exchanger body. The exchanger body forms a multi-helix, in particular a double helix or multiple concentric ring surfaces, wherein the windings of the multi-helix or the concentric ring surfaces form separating walls (3, 4) between the at least one first and the at least one second channel (150, 151). The device according to the invention allows for the formation of exchanger devices with high efficiency yet also with a small outer diameter. The manufacturing process is also simplified.
POINT OF DISPENSE HEAT EXCHANGER FOR FLUIDS
A heat exchanger for fluids includes an elongated conduit. At least two spaced fluid passageways are defined in the conduit and extend longitudinally through the conduit from a first end thereof to a second end thereof. A heat transfer element thermally contacts a surface of the conduit to transfer heat to or from a fluid flowing through the at least two spaced passageways. The conduit can be unitary and of one piece. In one embodiment, the conduit can be a single crystal.
COOLING MODULE
A cooling module has a heat generating body, a heat exchanger made of metal, and an insulating plate. The heat generating body has a heat dissipating surface. The heat exchanger has cooling surface facing the heat dissipating surface. The insulating plate has a first surface and a second surface. The insulating plate is interposed between the heat dissipating surface and the cooling surface on a condition that the insulating plate faces the heat dissipating surface and that the second surface faces the cooling surface. The insulating plate and the cooling surface are joined to be one body by a joining material. The heat dissipating surface and the insulating plate are in close contact with each other through an elastic member. The heat dissipating surface and the cooling surface are thermally connected to each other through the joining material, the insulating plate, and the elastic member.
COOLING MODULE
A cooling module has a heat generating body, a heat exchanger made of metal, and an insulating plate. The heat generating body has a heat dissipating surface. The heat exchanger has cooling surface facing the heat dissipating surface. The insulating plate has a first surface and a second surface. The insulating plate is interposed between the heat dissipating surface and the cooling surface on a condition that the insulating plate faces the heat dissipating surface and that the second surface faces the cooling surface. The insulating plate and the cooling surface are joined to be one body by a joining material. The heat dissipating surface and the insulating plate are in close contact with each other through an elastic member. The heat dissipating surface and the cooling surface are thermally connected to each other through the joining material, the insulating plate, and the elastic member.
ADDITIVE MANUFACTURING PROCESSES AND ADDITIVELY MANUFACTURED PRODUCTS
A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.
Structure, electronic element module, heat exchanger, fuel rod, and fuel assembly
Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.
Method for joining metallic member and resin member to each other, manufacturing method for cooler, and cooler
A polar functional group is added onto a surface of a metallic member. A resin member contains an adhesive functional group. The adhesive functional group and the polar functional group attract each other. A method for joining the metallic member and the resin member to each other includes: heating a junction between the metallic member and the resin member while pressing the metallic member and the resin member against each other with a first load; maintaining temperature of the junction higher than melting temperature of a resin that structures the resin member while pressing the metallic member and the resin member with each other with a second load smaller than the first load; and cooling the junction to temperature lower than the melting temperature while pressing the metallic member and the resin member against each other with a third load larger than the second load.