A cooling unit includes a heat exchanger coil positioned coupled to a source of fluid. The heat exchanger includes at least one coil configured to face air being drawn through the heat exchanger. The at least one coil has a first pipe, a second pipe spaced from the first pipe, and a plurality of micro-channels disposed between and in fluid communication with the first pipe and the second pipe. Each of the first pipe, the second pipe and the plurality of micro-channels is configured to enable a countercurrent configuration between inner and outer fluids. Other embodiments of the cooling unit and methods of cooling are further disclosed.

A micro heat pipe includes a pipe body, a second capillary structure disposed inside the pipe body, and a working fluid injected into the pipe body. The pipe body has two enclosed ends and is defined with a heat absorbing section, a heat isolating section and a condensing section. The pipe body is provided on an inner pipe wall thereof with etched patterns serving as a first capillary structure and fully distributed in the aforementioned sections. The heat absorbing section is filled up with the second capillary structure. The micro heat pipe is manufactured in a way that the inner pipe wall of the pipe body is etched to form the first capillary structure, the second capillary structure is filled in the heat absorbing section and then sintered, the working fluid is injected into the pipe body, and the pipe body is vacuumed and sealed.

A method for improving heat transfer during distillation and concentration of extract with solvent includes providing a distillation vessel having a heat transfer surface and preparing the heat transfer surface with a plurality of surface features. A distillation and concentration system includes a distillation vessel having a heat transfer surface prepared with a plurality of surface features in accordance with the method.

A microchannel heat exchanger structure with a nozzle and a working method thereof. The microchannel heat exchanger structure with a nozzle, includes a first heat exchange portion, a second heat exchange portion, and at least one nozzle portion between the first heat exchange portion and the second heat exchange portion, the first heat exchange portion having a high-pressure heat exchange channel, a first micro-fin array being provided inside the high-pressure heat exchange channel, and the second heat exchange portion having a low-pressure heat exchange channel, the high-pressure heat exchange channel and the low-pressure heat exchange channel being in communication through at least one nozzle disposed in the nozzle portion. The heat exchanger structure has a good heat exchange effect and can achieve a better heat flux during heat exchange.

A microtube heat exchanger is disclosed, including two end plates with an array of holes or openings and an array of microtubes disposed in the array of openings between the two end plates. The heat exchanger can be used in environmental control systems, including systems for aerospace applications.

A heat exchanger includes: a first layer including first flow channels that are microchannels and arranged to extend side by side; and a second layer that is laminated on the first layer and that includes second flow channels that are microchannels and arranged to extend side by side. A first one end-side collective flow channel is in fluid communication with first ends of the first flow channels. A first other end-side collective flow channel is in fluid communication with second ends of the first flow channels. A second one end-side collective flow channel is in fluid communication with first ends of the second flow channels. A second other end-side collective flow channel is in fluid communication with second ends of the second flow channels.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

A flat-plate heat pipe and a preparation method thereof, and a heat exchanger are provided. The flat-plate heat pipe includes an upper shell (11) and a lower shell (12); the upper shell (11) and the lower shell (12) are assembled with each other to form a flat-plate shell (10) with a sealed cavity; the sealed cavity is filled with a phase change working medium; a capillary wick (20) is arranged in the flat-plate shell (10); and a surface of the capillary wick (20) has a micro-nano structure. By means of the arrangement of the above capillary wick having the micro-nano structure on the surface thereof, the flat-plate heat pipe has excellent heat conductivity and high resistance to gravity, and is flexible in use and arrangement.

A microtube heat exchanger is disclosed, including two end plates with an array of holes or openings and an array of microtubes disposed in the array of openings between the two end plates. The heat exchanger can be used in environmental control systems, including systems for aerospace applications.

A heat sink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.