A cracked gas cooling heat exchanger includes a tube connection between an uncooled tube (1) and a cooled tube (2), having a cooled inner tube (3) enclosed by a jacket tube (4), with a tube intermediate space (5) for flowing cooling medium. A gas inlet header (11) has a GI tube inner part (12) and a GI tube outer part (13) and a cooling space (14) with an insulating layer (15). The GI tube outer part connects via a water chamber (6) to the jacket tube. The GI tube inner part faces the inner tube and is connected on a face (8) of the water chamber. A weld backing ring (16), between an end face (9) of the cooling space and a bottom face (8) of the water chamber, is in the insulating layer of the cooling space, arranged in a turn-out/groove (17) in the insulating layer.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

The presently claimed invention relates to a heat exchanger and a method of exchanging heat.

The invention relates to a method for maintaining the temperature of fluid media in pipes even in the event of an interruption of the fluid media flow. In a first step, a heat reservoir layer (1) is produced comprising a latent heat reservoir material (2) and a matrix material (3). In a second step, the heat reservoir layer (1) is either arranged around a pipe (4) and subsequently encased with a heat damping material (5) or the heat reservoir layer (1) is brought into contact with heat damping material (5), whereby a heat reservoir damper composite (51) is obtained, and the pipe (4) is then encased with the heat reservoir damper composite (51) such that the heat reservoir layer (1) of the heat reservoir damper composite (51) lies between the pipe (4) and the heat damping material (5) of the heat reservoir damping composite (51).

A device for energy transfer and for energy storage in a liquid reservoir has a water heat exchanger arranged on a bottom and has an air heat exchanger arranged above the water heat exchanger, wherein the water heat exchanger is arranged in a liquid reservoir that is surrounded by an inner shell which delimits the device with respect to an outer shell covering the inner shell from the bottom, wherein the outer shell is at least partially inserted into an earth layer, and the device is closed upwardly by a lid in such a way as to make it possible to generate a flow of air from an air inlet to an air outlet of the air heat exchanger.

A heat exchanger includes: a plurality of flat tubes each of which has a refrigerant flow passage through which refrigerant flows in an up-down direction, the plurality of flat tubes being arranged parallel to each other at intervals; a plurality of fins each of which is provided between adjacent flat tubes of the plurality of flat tubes; an upper header to which an upper end portion of each of the plurality of flat tubes is connected; and a lower header to which an a lower end portion of each of the plurality of flat tubes is connected. Lower end portions of the plurality of fins are not joined to the lower header, and a lower gap is formed between the lower end portions of the plurality of fins and the lower header.

A mobile phase-change heat and cold storage device include heat transfer plates, a bracket, a casing, a main tube, a storage tank, and a phase-change working medium. Heat is stored and released by the phase-change working medium, and the main tube and casing provide an interface between the heat and cold storage device and the outside world. In the process of heat storage, vapor flows through the heat transfer plates via the main tube; heat is transferred to the phase-change working medium via the heat transfer plates, and is transported in a box body to a designated position; cold water flows through the heat transfer plates via the casing; heat is transferred from the phase-change working medium to the cold water via the heat transfer plates to obtain hot water; the phase-change working medium can release heat by exothermic solidification. The process of cold storage is similar thereto.

A compact heat exchanger unit within an air conditioning apparatus for a vehicle, and a condenser region for the condensation of refrigerant is formed as a heat exchanging surface, and a high-pressure-refrigerant collector region as a refrigerant collector is formed in the integrated form as a plate packet of a heat exchanger within a plate heat exchanger.

A total heat exchange element includes a stacked body that is formed by alternately stacking a first layer provided with a first passage through which a first air flow passes and a second layer provided with a second passage through which a second air flow passes. The stacked body includes a partition member between the first layer and the second layer, a spacing member provided in the first layer and the second layer and maintaining a spacing between the partition members facing each other, and a latent heat shielding member provided partly on the partition member and shielding transfer of latent heat between the first air flow and the second air flow through the partition member.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.