A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation plate. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation plate is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

Provided is a heat exchanger automatic assembly apparatus including: a fin distribution unit distributing fins; a fin transfer unit including two or more fin trays and a driving means connected to the fin trays, respectively, to selectively transfer the fin trays to a predetermined position; and a fin discharge unit discharging the fins stored in the fin trays of the fin transfer unit to the predetermined position. The fins may be continuously supplied to the fin trays without stopping the supply of the fins to the fin trays and the plurality of fins may be discharged at one time to allow the fins to be interposed between the tubes arranged to be spaced apart from each other, thereby reducing a supply time of the fin to improve productivity, and reducing discarded fins to reduce the manufacturing cost.

A heat transfer tube includes: an outer tube; an inner tube inserted into the outer tube so as to be in close contact with the outer tube, to form a double tube with the outer tube; an insertion hole formed, between an outer circumferential surface of the outer tube and an inner circumferential surface of the inner tube, penetrating in a longitudinal direction of the outer tube and the inner tube; and an insertion tube inserted into the insertion hole The insertion tube allows an optical fiber to be inserted into the insertion tube to measure a surface temperature of the double tube.

A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation structure. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation structure is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.

The present invention discloses an improve plate for plate heat exchangers (PHE) which its parameters are tailor-made to be utilized in industrial operation comprising various set of at least one first fluid and at least one second fluid having different physical and chemical characteristics and hence requires different two or more sets of PHE-related parameters. The invention also discloses method of using and manufacturing the same.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

Provided is a heat exchanger capable of being efficiently and easily produced. The present invention is directed to a heat exchanger having an outer packaging body 1 having an inlet 16, an outlet 16, a pair of opposing walls, and a corrugated inner fin 2 disposed between the pair of opposing walls and provided alternately and continuously with a concave portion 25 and a convex portion 26. The outer packaging body 1 is formed of an outer packaging laminate material L1 in which a resin heat-fusible layer 52 is provided on an inner surface side of a metal heat transfer layer 51. The inner fin 2 is formed of an inner core laminate material L2 in which a heat-fusible layer 62 is provided on both surface sides of a metal heat transfer layer 61. The inner fin 2 is formed in a rectangular wave shape in which a concave portion and a convex portion are alternately and continuously provided, a concave bottom wall of the inner fin and a convex top wall of the inner fin are arranged parallel to the pair of opposing walls, and a rising wall connecting the concave bottom wall and the convex top wall is arranged perpendicular to the pair of opposing walls.

A cooling device includes a metal member, a cooling member, and a sheet-shaped thermal conductive member. The metal member thermally couples with an element that generates heat. The cooling member includes a channel for refrigerant to flow. The thermal conductive member includes an adhesive surface adhered to the metal member and a non-adhesive surface pressed against and thermally coupled in contact with the cooling member. The thermal conductive member and the cooling member are separable.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.